Method for recovering silicon material from waste materials in cutting crystalline silicon by diamond wire

A diamond wire cutting, silicon material technology, applied in chemical instruments and methods, silicon compounds, non-metallic elements, etc., can solve the problems of lack of reasonable waste silicon material recycling and treatment methods, increase production costs of enterprises, environmental damage, etc. The effect of low cost, easy operation and simple method
CN102642835AInactive Publication Date: 2012-08-22ZHENJIANG HUANTAI SILICON TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ZHENJIANG HUANTAI SILICON TECH
Publication Date
2012-08-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a method for recovering silicon material from waste materials in cutting crystalline silicon by a diamond wire. The method is characterized by comprising the following steps of: feeding the collected waste materials to a centrifugal machine to centrifuge and settle, thus obtaining silicon material sediment; carrying out solid-phase rinsing on the silicon material sediment to remove organic matter type impurities and part of diamond powder from residual liquid in solid, thus obtaining silicon powder with certain purity; pickling the solid-phase silicon powder with hydrochloric acid to remove metal impurities; after rinsing the silicon powder subjected to hydrochloric acid pickling with pure water, rinsing the silicon powder with hydrofluoric acid to remove oxide from the surface of the silicon powder; carrying out ultrasonic rinsing and drying on the silicon material rinsed with hydrofluoric acid; carrying out directional solidification, ingot casting and purification on the dried silicon material, thus obtaining a solar grade silicon material; and at last, carrying out packaging after smashing, pickling, rinsing and drying the silicon material. The method is simple and convenient, the equipment cost is low, the operation is easy to control, the treatment recovery rate is high and the overall recovery rate can achieve over 99.99%.
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Description

technical field

[0001] The invention relates to a method for recovering silicon material and removing impurities, in particular to a method for recovering silicon material from waste produced by diamond wire cutting crystal silicon. Background technique

[0002] Silicon wafers used for solar photovoltaic cells are straight-pulled from polycrystalline silicon raw materials into single crystal rods or cast into polycrystalline ingots. After removing the unqualified areas such as the head, tail and some shadows of the silicon ingots, they are cut into thin slices by a slicer made. The current slicing technology mainly includes steel wire carrying slurry cutting and diamond wire cutting technology. In the process of cutting with diamond wire, the silicon powder cut off enters the cooling water system of the slicer. The main component of these solid wastes is silicon powder, mixed with some metal impurities mainly nickel, trace diamond particles, Dust mud, organic impurities, e...

Claims

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