Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof

A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc., can solve harsh reaction conditions, reduce toughness, and it is difficult to obtain bisphenol fluorene-based epoxy resin and other problems, to achieve the effect of high bond strength, high fullness, enhanced mechanical strength and electrical properties

Active Publication Date: 2012-08-22
ZHEJIANG RONGTAI TECH ENTERPRISE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the bisphenol fluorene structure contained in the prepared resin, the increase of the benzene ring structure and the rigidity of the resin reduce the toughness and limit the application. In addition, bisphenol fluorene is a powdery solid with a melting point as high as 224 ° C. It is prepared from it Bisphenol fluorene epoxy resin needs harsh reaction conditions, it is not easy to obtain complete bisphenol fluorene epoxy resin

Method used

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  • Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof
  • Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof
  • Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The preparation of modified epoxy resin: the EPN (DOW company D.E.N.431) of weight part 30, the TGIC (CIBA company PT-801) of weight part 8, the TDE (Swiss CIBA company TDE-85) of weight part 55, join in In the reaction vessel, stir and heat up to 100°C, mix for 1.5 hours, cool to 70°C and vacuumize for 40 minutes at a vacuum degree of not less than 0.095MPa, cool down to 60°C, and add 7 parts by weight of co-solvent (ethanol and acetone according to mass ratio of 30:50, the same below), after mixing for 1 hour, the material was filtered to obtain a viscous liquid with a viscosity of 17000mPa.s at 25°C.

[0030]Preparation of curing agent: After heating HMNA (Puyang Huicheng Chemical Co., Ltd.) of 35 parts by weight, MHHPA (Hitachi Chemical NH-5500) of 45 parts by weight, and MCTC of 12 parts by weight to 150 ° C to dissolve evenly, add 3 parts by weight The trimethylolpropane was reacted at 150°C for 1 hour, cooled to 70°C and vacuumed for 30 minutes under a vacuum of ...

Embodiment 2

[0034] The preparation of modified epoxy resin: the EPN (DOW company D.E.N.431) of weight part 28, the TGIC (CIBA company PT-801) of weight part 15, the TDE (Swiss CIBA company TDE-85) of weight part 48, weight part Add the 1,4-butanediol diglycidyl ether of 5 into the reaction vessel, stir and heat up to 100°C, mix for 1.5 hours, cool to 70°C and vacuumize for 40 minutes under a vacuum of not less than 0.095MPa, and cool down After reaching 60°C, add 4 parts by weight of solvent, mix for 1 hour, and filter out the material to obtain a viscous liquid with a viscosity of 18700 mPa.s at 25°C.

[0035] Heat-resistant epoxy resin glue preparation: the resin component and the curing agent component of Example 1 were heated and mixed at 30° C. at a weight ratio of 10:9, and the viscosity of the mixture was 4250 mPa.s.

[0036] The glass transition temperature and cohesiveness of the obtained epoxy resin glue were tested, and the curing conditions for sample preparation were 120°C / 40...

Embodiment 3

[0038] Modified epoxy resin preparation: the EPN (DOW company D.E.N.431) of weight part 28, the TGIC (CIBA company PT-801) of weight part 10, the TDE (Swiss CIBA company TDE-85) of weight part 60, weight part 2 Add 1,4-butanediol diglycidyl ether into the reaction vessel, stir and heat up to 100°C, mix for 1.5 hours, cool to 70°C and vacuumize for 40 minutes under a vacuum of not less than 0.095MPa, cool to 60°C, a viscous liquid with a viscosity of 29000mPa.s at 25°C was obtained.

[0039] Preparation of curing agent: After heating HMNA of 45 parts by weight, MHHPA (Hitachi Chemical NH-5500) of 40 parts by weight, and MCTC of 12 parts by weight to 150 ° C to dissolve evenly, add trimethylolpropane of 3 parts by weight at 150 Reaction at ℃ for 1 hour, cooling to 70 ℃ and vacuuming for 30 minutes at a vacuum degree of not less than 0.095 MPa, adding 1.5 parts by weight of a mixing accelerator, mixing for 1 hour to obtain a homogeneous liquid with a viscosity of 1200 mPa.s.

[...

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Abstract

The invention relates to a epoxy resin adhesive with high heat resistance, which is obtained by mixing of modified epoxy resin with the viscosity of 1000-30000mPa.s and a curing agent with the viscosity of 100-3000mPa.s under the room temperature of more than 20 DEG C according to the mass ratio of 1:0.5-1:1.2. The epoxy resin adhesive is obtained by mixing of modified epoxy resin and the heat-resistant acid anhydride curing agents as the main raw materials, the mechanical strength and electric property of cured resin is enhanced by the modified epoxy resin and applied to dropping impregnation resin for motor rotor with high heat resistance requirement to obtain an insulation system with high fullness, good heat resistance (the glass transition temperature is 160-200 DEG C), high adhesivestrength and bright surface, so that the requirements of life tests and impact tests during high speed rotation of an automobile motor are met.

Description

technical field [0001] The invention relates to an epoxy resin, in particular to an epoxy resin glue with high heat resistance, which is especially suitable for impregnated insulation of high-temperature motor rotor products. Background technique [0002] In the motor manufacturing industry, in addition to the correct and reasonable overall design of the motor, corresponding high-performance insulating materials are required to ensure it. At the same time, certain technological means must be available to achieve it, such as: 1) Motors with a speed of 30,000-50,000 rpm For high-speed motors, the rotor windings under high-speed operation must be prevented from being scattered under the action of strong centrifugal force, and must be firmly bonded; 2) The motor shaft is directly connected to the gearbox to withstand a large torque, and the motor requires intermittent opening and closing; 3) When the motor rotates at a high speed, the rotor end winding and the end binding surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06
Inventor 曹万荣祝阳
Owner ZHEJIANG RONGTAI TECH ENTERPRISE
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