Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof
A dielectric insulation, hot-melt technology, applied in the direction of in-line phenolic epoxy resin adhesive, epoxy resin adhesive, adhesive type, etc., can solve the problems of expensive equipment and high process requirements, and achieve convenient construction and saving. energy effect
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[0024] First, the method for manufacturing the hot-melt halogen-free flame-retardant thermally conductive dielectric insulating layer resin will be described. The resin can be obtained through the following steps:
[0025] (1) Surface modification of thermally conductive powder
[0026] The most commonly used surfactant for surface modification is a silane coulping agent. The silane coupling agent is a compound containing bifunctional groups. The hydrolyzable functional groups on the silicon atom will undergo hydrolysis and condensation reactions with moisture. A silanol group (Si-OH) is formed, which can be combined with the hydroxyl group (-OH) on the surface of the inorganic thermally conductive powder.
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