Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof
A dielectric insulation, hot-melt technology, applied in the direction of in-line phenolic epoxy resin adhesive, epoxy resin adhesive, adhesive type, etc., can solve the problems of expensive equipment and high process requirements, and achieve convenient construction and saving. energy effect
Active Publication Date: 2012-09-26
日邦树脂(无锡)有限公司
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Problems solved by technology
The above process requirements are high and the equipment is expensive
Method used
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[0024] Firstly, the manufacturing method of the hot-melt halogen-free flame-retardant heat-conducting dielectric insulating layer resin is described, and the resin can be obtained through the following steps:
[0025] (1) Surface modification of thermally conductive powder
[0026] The most commonly used surfactant for surface modification is silane coupling agent (silane coupling agent), which is a compound containing two functional groups. The hydrolyzable functional group on the silicon atom will undergo hydrolysis and condensation reactions with water to form A silanol group (Si-OH) is formed, and this silanol group can combine with the hydroxyl group (-OH) on the surface of the inorganic heat-conducting powder.
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Abstract
The invention relates to resin material and an application thereof, and particularly relates to epoxy resin and the application thereof on a copper foil base plate. The hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin is prepared through the following methods: (1), modifying the surface of heat conducting powder, (2), synthesizing of phenolic resin containing phosphorus and nitrogen phenolic resin, and (3), synthesizing hot-melting type halogen-free fire-retardant and heat conducting dielectric insulating layer resin. The hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer provided by the invention is different from the original that solvent-based epoxide resin glue solution is required to be used, the complex coating technique is not required, all that is needed is to directly coat the hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer onto copper foil after heating and melting, the adhesive coating thickness can be effectively controlled, an expensive precision coating system and baking equipment are not required to be used, the time is saved, the construction is convenient, and energy is saved.
Description
technical field [0001] The invention relates to a resin material and its application, in particular to an epoxy resin and its application to a copper foil substrate. technical background [0002] Epoxy resin insulation material without glass fiber cloth, its manufacturing process is due to the resin insulation layer (film and soft board type) without glass fiber, the resin must be coated on the copper foil base material in production, coating The combination of the resin material formula used in the process and the process parameters, including the viscosity, solid content, solvent composition and rheological properties of the resin, will have a great impact on the coating quality. Due to the limitation of characteristics, the commonly used resins now require precision coating and baking system technology. In addition, in order to maintain the surface characteristics of the finished product and ensure the processing quality of fine lines, the overall coating system must be c...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08L63/00C08L63/04C08L61/16C08K13/06C08K9/06C08K3/38C08K3/22C08K5/5313C09J7/02C09J163/00C09J163/04C09J11/04C09J11/06
Inventor 赖建成李宁吉和信罗学平
Owner 日邦树脂(无锡)有限公司
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