Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte

A superhydrophobic surface, copper matrix technology, applied in the field of materials, can solve the problems of complex process control, hindering the large-scale application of engineering, expensive materials, etc., to achieve the effect of safe operation, stable superhydrophobicity, and simple method

Inactive Publication Date: 2012-09-26
XIAN UNIV OF SCI & TECH
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the preparation methods mainly include electrodeposition, chemical vapor deposition, plasma etching, anodic oxidation, chemical corrosion, laser treatment, electrospinning, sol-gel, etc. Howev

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte
  • Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte
  • Electrochemical method for preparing superhydrophobic surface on copper substrates by using aqueous electrolyte

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Step 1. Dissolve 0.56g of potassium hydroxide and 1.35g of potassium persulfate powder in distilled water, set the volume to 100mL, and stir evenly to obtain a product with a concentration of potassium hydroxide of 0.1mol / L and a concentration of potassium persulfate of 0.05mol / L. Solution A;

[0024] Step 2. Dissolve 2.28 g of myristic acid in absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.1 mol / L;

[0025] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0026] Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of...

Embodiment 2

[0029] Step 1. Dissolve 0.56g of potassium hydroxide and 1.35g of potassium persulfate powder in distilled water, set the volume to 100mL, and stir evenly to obtain a product with a concentration of potassium hydroxide of 0.1mol / L and a concentration of potassium persulfate of 0.05mol / L. Solution A;

[0030] Step 2. Dissolve 2.28 g of myristic acid in absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.1 mol / L;

[0031] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0032] Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of...

Embodiment 3

[0036] Step 1. Dissolve 0.168g of potassium hydroxide and 2.7g of potassium persulfate powder in distilled water, set the volume to 100mL, and stir evenly to obtain a product with a concentration of potassium hydroxide of 0.03mol / L and a concentration of potassium persulfate of 0.1mol / L. Solution A;

[0037] Step 2. Add 0.228 g of myristic acid into absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.01 mol / L;

[0038] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0039] Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Concentrationaaaaaaaaaa
Concentrationaaaaaaaaaa
Concentrationaaaaaaaaaa
Login to view more

Abstract

The invention discloses an electrochemical method for preparing a superhydrophobic surface on copper substrates by using an aqueous electrolyte. The method comprises the steps of: I, dissolving potassium hydroxide and potassium peroxydisulfate into distilled water to obtain a solution A; II, dissolving tetradecanoic acid into anhydrous ethanol to obtain a solution B; III, polishing the two copper substrates by using waterproof abrasive paper, then cleanly washing the two copper substrates by sequentially using the distilled water and the anhydrous ethanol, and drying for later use; IV, placing the solution A, as an electrolyte, into an electrolytic cell, and utilizing the two dried copper substrates as an anode and a cathode respectively to electrolyze; and V, cleanly washing the electrolyzed anode copper substrate by sequentially using the distilled water and the anhydrous ethanol, then uniformly smearing the solution B to a surface of the cleanly washed anode copper substrate, and airing to obtain the copper substrates with the super-hydrophobic surface. A contact angle of the super-hydrophobic surface prepared on the copper substrates by using the method can reach more than 152 degrees, and the super-hydrophobic performance keeps stable after the copper substrates are placed in a normal condition for one year.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to an electrochemical method for preparing a superhydrophobic surface on a copper substrate by using a water electrolyte. Background technique [0002] Many plants in nature, such as lotus leaves, exhibit extraordinary superhydrophobic properties, with contact angles as high as 150° and rolling angles below 3°. Inspired by this, researchers have carried out research on superhydrophobic properties, and this direction has developed into a research hotspot in surface science. It was found that the superhydrophobic properties mainly depend on the chemical composition and microstructure. Generally, superhydrophobic surfaces are constructed by modifying low surface energy substances on rough surfaces or constructing rough structures on the surface of superhydrophobic materials. At present, the preparation methods mainly include electrodeposition, chemical vapor deposition, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C25D11/34
Inventor 郝丽梅郭长立王新霞张鹏利
Owner XIAN UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap