Preparation method of polymer-based conductive microporous foam composite material

A composite material and microcellular foam technology, applied in the field of polymer foam materials, can solve the problems of large cell diameter, poor mechanical properties and electrical conductivity of foam materials, etc., and achieve small cell diameter, high cell density, and mechanical properties. Good results

Inactive Publication Date: 2012-10-10
SICHUAN UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] For the deficiencies in the preparation methods of conductive polymer foam materials in the prior art, the purpose of the present invention is to provide a new method for preparing polymer-based conductive foam composite materials to solve the problem of polymer-based conductive foam materials prepared in the prior art. There are problems such as large cell diameter, poor mechanical properties and poor electrical conductivity of foam materials

Method used

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  • Preparation method of polymer-based conductive microporous foam composite material
  • Preparation method of polymer-based conductive microporous foam composite material
  • Preparation method of polymer-based conductive microporous foam composite material

Examples

Experimental program
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Embodiment 1

[0027] In this embodiment, polylactic acid (PLA) and hydroxylated multi-walled carbon nanotubes (MWNTs) are used as raw materials. Polylactic acid is produced by NatureWorks Corporation of the United States, model 2002D, which is a semi-crystalline polymer, and the mass content of D-polylactic acid is 4.25%. Density is 1.24 g / cm 3 , Hydroxylated multi-walled carbon nanotubes are produced by Chengdu Organic Chemistry Co., Ltd., Chinese Academy of Sciences, model: TNMH5, purity greater than 95%, -OH mass content is 1.76%, outer diameter: 20-30 nm, length about 30 μm.

[0028] Process conditions and steps are as follows:

[0029] (1) Dissolve 5 g of polylactic acid in 50 ml of dichloromethane solvent, and at the same time disperse 208 mg of carbon nanotubes in 20 ml of dichloromethane by ultrasonic vibration, and then pour the carbon nanotube dispersion into the polylactic acid solution Afterwards, carry out ultrasonic oscillation, and after the carbon nanotubes are uniformly di...

Embodiment 2

[0035] Present embodiment raw material is identical with embodiment 1

[0036] Process conditions and steps are as follows:

[0037] (1) Same as step (1) of embodiment 1;

[0038] (2) Same as step (2) of embodiment 1;

[0039](3) Put the green body obtained in step (2) into a foaming high-pressure reactor, and pass through supercritical CO 2 , the pressure in the reactor is controlled at 24 MPa, the temperature is controlled at 115 ℃, so that the supercritical CO 2 Dissolved into the composite sheet body, when supercritical CO 2 After reaching the saturated state in the composite sheet blank, the pressure in the reactor is released to normal pressure at a pressure relief rate of about 30 MPa / s, and a conductive polymer-based microcellular foam is obtained after cooling and setting composite material.

[0040] Volume resistivity: In order to reduce the contact resistance, after applying silver glue on both ends of the conductive cell, Tonghui TH2684 high-precision insulati...

Embodiment 3

[0043] Present embodiment raw material is identical with embodiment 1

[0044] Process conditions and steps are as follows:

[0045] (1) Dissolve 5 g of polylactic acid in 50 ml of dichloromethane solvent, while ultrasonically dispersing 102 mg of carbon nanotubes in 20 ml of dichloromethane, and then pour the carbon nanotube dispersion into the polylactic acid solution Afterwards, carry out ultrasonic oscillation, and after the carbon nanotubes are uniformly dispersed, pour the dispersion liquid into a glass petri dish with a cover to volatilize the solvent. PLA / MWCNTs composite material with a mass fraction of 2%;

[0046] (2) Same as step (2) of embodiment 1;

[0047] (3) Same as step (3) of Example 1.

[0048] Volume resistivity: In order to reduce the contact resistance, after applying silver glue on both ends of the conductive cell, Tonghui TH2684 high-precision insulation resistance tester is used to test the resistance, and the volume resistivity of the conductive f...

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Abstract

The invention discloses a preparation method of a polymer-based conductive microporous foam composite material. The method comprises the following steps of: filling conductive fillers into a polymer to prepare a polymer-based composite material through blending methods of solution blending, melt blending or in-situ polymerizing and the like; preparing a composite material blank with a certain thickness from the polymer-based composite material by die pressing under vacuum; placing the composite material blank into a foaming high-pressure reactor, and dissolving supercutical fluid serving as foaming agent in the composite material blank; and foaming the composite material blank through a quick pressure releasing method or quick heating method when the supercutical fluid in the composite material blank is saturated, and then cooling to shaping the foamed composite material blank. According to the preparation method, the nontoxic pollution-free supercutical fluid is taken as the foaming agent, thus, the preparation method has the advantages of environmental protection, safety, stability, etc. The preparation method serves as a conductive foam material preparation technology with good application prospect.

Description

technical field [0001] The invention relates to the technical field of polymer foam materials, in particular to a preparation method of a polymer-based conductive microporous foam composite material. Background technique [0002] As one of the three major materials, polymer materials have the advantages of light weight, easy processing, corrosion resistance and low cost compared with metal materials and inorganic materials, and are widely used in packaging, medical treatment, national defense and other fields. Polymer materials usually have a large volume resistivity, about 10 10 ~10 20 Ω·cm, can be used as an excellent electrical insulating material. However, the high volume resistivity limits the application of polymer materials in electronic device packaging and electromagnetic shielding. [0003] Conductive polymer foam materials are widely used in electronic devices, antistatic packaging, electromagnetic shielding, etc. Compared with metals, conductive polymer foam ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/12C08L67/04C08K9/00C08K7/00C08K3/04C08L25/06
Inventor 廖霞何婷鲍道飞张懿凡
Owner SICHUAN UNIV
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