Composition for film, and adhesive film and cover lay film formed therefrom

A technology of composition and thin film, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc. It can solve the problems of resin hydrolysis or decrease in adhesion, and achieve the effects of good workability, low dielectric constant, and excellent adhesion strength

Inactive Publication Date: 2014-08-13
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is considered that the flame-retardant resin composition described in Patent Document 1 has a problem caused by the blending of the above-mentioned phosphorus-based flame retardant.
In the flame retardant resin composition described in Patent Document 1, it is necessary to use a phosphorus-containing compound (B) in addition to the resin (A) containing phosphorus in the molecule, as described in paragraph [0020] of this document, because when When imparting high flame retardancy with the resin (A), it is necessary to copolymerize a large amount of phosphorus compounds, which causes problems such as hydrolysis of the resin itself or decrease in adhesiveness.

Method used

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  • Composition for film, and adhesive film and cover lay film formed therefrom
  • Composition for film, and adhesive film and cover lay film formed therefrom
  • Composition for film, and adhesive film and cover lay film formed therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0133] (Examples 1-8, Comparative Examples 1-4)

[0134] After dissolving each component with a solvent (butanone) to a predetermined solvent concentration, put it into a reaction kettle heated to 25°C at the mixing ratio (parts by mass) shown in the following table, and rotate it at a rotation speed of 300rpm for regular Mix under pressure for 1 hour.

[0135] After coating the obtained solution (varnish containing the film composition) on a substrate (PET film subjected to mold release treatment), the substrate was heated to remove the solvent, and then the film was removed from the substrate.

[0136] The abbreviations in the table are as follows.

[0137] (A) Ingredients

[0138] NC3000H: Biphenyl-type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.)

[0139] Mn590

[0140] (B) Ingredients

[0141] UR3570: Polyurethane resin composed of phosphorus-containing polyols (manufactured by Toyobo Co., Ltd.)

[0142] Mn15000

[0143] (C) Ingredients

[0144] BMI-70...

Embodiment 9、 comparative example 5

[0174] The following evaluations were performed on a film produced in the same procedure as in Example 4 (Example 9) and a commercially available polyimide film (Kapton, manufactured by Toray DuPont Co., Ltd.) (Comparative Example 5). The film thicknesses were all 25 μm.

[0175] Peel strength: The film composition was sandwiched between polyimide films (Kapton 100H, manufactured by Toray DuPont Co., Ltd., thickness 25 μm) and hardened by vacuum molding (1 hr at 180° C., 1 MPa, vacuum degree < 10 kPa). The obtained sample was cut into a width of 10 mm, and the peel strength (180-degree peel, speed 50 mm / min) was measured with a universal testing machine (AG-IS manufactured by Shimadzu Corporation).

[0176] Folding resistance: The MIT test (R=1.MD) was implemented according to JIS P8115 about the film after heating and hardening at 150 degreeC*1h. The table below shows the number of bends at the point when the film breaks.

[0177] Insertion loss: A microstrip line was produ...

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Abstract

Provided are an adhesive film and a cover lay film both for use in electrical / electronic applications, the films having excellent flame retardancy and being capable of attaining a reduction in permittivity and a reduction in dielectric loss in a high-frequency region. Also provided is a composition for use in producing these films. The composition for films is characterized by comprising (A) an epoxy resin containing no hydroxy group, (B) a urethane resin containing a phosphorus-containing polyol as a component, (C) a compound having a maleimide group, and (D) a hardener, the ingredients (B) and (C) being contained in amounts of 100-975 parts by mass and 25-100 parts by mass, respectively, per 100 parts by mass of the ingredient (A), the ingredient (D) being contained in an effective amount, and the proportion by mass of the phosphorus to the sum of the ingredients (A) to (D) being 2-7%.

Description

technical field [0001] The present invention relates to a composition for film. Specifically, it relates to a film composition suitable for an adhesive film for electric / electronic use or a cover film for a printed wiring board. [0002] Moreover, this invention relates to the adhesive film and cover film produced using this composition for films. Background technique [0003] In recent years, printed wiring boards used in electrical / electronic equipment have become more compact, lightweight, and high-performance, especially for multi-layer printed wiring boards, and higher multi-layer and high-density Minimization, thinning, lightweight, high reliability, and formability, etc. [0004] In addition, with the recent demand for high-speed transmission signals of printed wiring boards, high-frequency transmission signals are being remarkably advanced. Accordingly, materials used for printed wiring boards are required to reduce electrical signal loss in a high-frequency regio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L75/04C08K5/3415C08L63/00H05K3/28
CPCC08G59/621C08K5/3415C08L63/00H05K3/285C08G59/686
Inventor 寺木慎吉田真树高桥聪子
Owner NAMICS CORPORATION
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