Modified bisphenol A-type epoxy resin and preparation method thereof

A technology of epoxy resin and bisphenol, which is applied in the field of epoxy resin and its preparation, can solve the problems of low yield, general rigidity and flexibility, and high reaction temperature of modified bisphenol A epoxy resin, and achieve high reaction speed Fast, flexible, and low reaction temperature

Inactive Publication Date: 2012-12-19
SUZHOU SIRGEL RESINS SPECIALTIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of this invention is to provide a kind of modified bisphenol A type epoxy resin and preparation method thereof, this modified bisphenol A type epoxy resin solves the general rigidity and flexibility and chemical resistance of existing modifi

Method used

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  • Modified bisphenol A-type epoxy resin and preparation method thereof
  • Modified bisphenol A-type epoxy resin and preparation method thereof
  • Modified bisphenol A-type epoxy resin and preparation method thereof

Examples

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Example Embodiment

[0035] Example 1: A modified bisphenol A epoxy resin and its preparation method

[0036] Accurately weigh 500 grams (g) of E-51 liquid epoxy resin and 445 grams (g) of behenic acid, stir and heat to 98°C under the protection of nitrogen, and then add 0.6 grams (g) of triphenylethyl Base phosphonium bromide, when the temperature of the reactant rises to 140-150 DEG C; keep the reactant at this temperature for 1.8 hours; after cooling, the material is discharged to obtain the modified bisphenol A epoxy resin. The epoxy equivalent of the product is 805 g / equivalent.

Example Embodiment

[0037] Example 2: A modified bisphenol A epoxy resin and its preparation method

[0038] Accurately weigh 500 grams (g) of DER 383 epoxy resin and 405 grams (g) of behenic acid, stir and heat to 96°C under the protection of nitrogen, and then add 0.5 grams (g) of triethanolammonium chloride. The temperature of the reactant is increased to 140-150°C; the reactant is kept to react at this temperature for 3.5 hours; after cooling, the material is discharged to obtain a modified bisphenol A epoxy resin. The epoxy equivalent of the product is 785 g / equivalent.

Example Embodiment

[0039] Example 3: A modified bisphenol A epoxy resin and its preparation method

[0040] Accurately weigh 500 grams (g) of EPIKOTE 828EL epoxy resin and 415 grams (g) of behenic acid, stir and heat to 98°C under nitrogen protection, and then add 0.8 grams (g) of triphenylethyl iodide Phosphonium, when the temperature of the reactant rises to 140-150°C; keep the reactant at this temperature to react for 2 hours; discharge after cooling to obtain the modified bisphenol A epoxy resin. The epoxy equivalent of the product was 780 g / equivalent.

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Abstract

The invention relates to modified bisphenol A-type epoxy resin and a preparation method thereof; the modified bisphenol A-type epoxy resin disclosed by the invention is a product obtained by reacting bisphenol epoxy resin and octadecanedicarboxylic acid under the effect of special catalyst; a carbon chain in a special structure is led into an epoxy resin molecule structure through the addition reaction of the modified bisphenol A-type epoxy resin and an epoxy group; the preparation method comprises the following steps: mixing epoxy resin and the octadecanedicarboxylic acid evenly; then, stirring a mixture under the protection of nitrogen while heating the mixture to 95-100 degrees centigrade; adding catalyst; keeping the reaction time of a reactant within 1.5-5 hours at a temperature when the temperature of the reactant reaches to 130-170 degrees centigrade; cooling the reactant; and discharging the reactant. According to the invention, the modified bisphenol A-type epoxy resin and the preparation method thereof have advantages of low reaction temperature, fast reaction speed, high yield, light color of the modified bisphenol A-type epoxy resin and good rigidity, toughness and chemistry resistance of modified curing epoxy resin.

Description

technical field [0001] The invention relates to an epoxy resin and a preparation method thereof, in particular to a modified bisphenol A type epoxy resin and a preparation method thereof. Background technique [0002] Bisphenol A type epoxy resin is a polymer compound refined by condensation of bisphenol A and epichlorohydrin under alkaline conditions, washed with water, and desolventized. It is widely used in anti-corrosion coatings, epoxy resin, glass fiber reinforced plastics, Epoxy resin overall floor, metal primer, industrial anti-corrosion paint and adhesives and other fields. [0003] Due to the strong rigidity of the crosslinked network of bisphenol A epoxy resin, the high brittleness of the cured product, the low heat resistance and toughness, and the poor heat and humidity resistance and weather resistance, it usually needs to be modified. At present, in the prior art, dimer fatty acid is generally used to modify bisphenol A epoxy resin. [0004] Dimerized fatty ...

Claims

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Application Information

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IPC IPC(8): C07D303/24C07D301/00C09D163/00
Inventor 张澜赵中德
Owner SUZHOU SIRGEL RESINS SPECIALTIES CO LTD
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