Modified bisphenol A-type epoxy resin and preparation method thereof
A technology of epoxy resin and bisphenol, which is applied in the field of epoxy resin and its preparation, can solve the problems of low yield, general rigidity and flexibility, and high reaction temperature of modified bisphenol A epoxy resin, and achieve high reaction speed Fast, flexible, and low reaction temperature
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Embodiment 1
[0035] Embodiment one: a kind of modified bisphenol A type epoxy resin and preparation method thereof
[0036] Accurately weigh 500 grams (g) of E-51 liquid epoxy resin and 445 grams (g) of eicosadioic acid, stir and heat to 98°C under nitrogen protection, then add 0.6 grams (g) of triphenylethyl ether Phosphonium bromide, when the temperature of the reactant rises to 140-150°C; keep the reactant at this temperature for 1.8 hours; after cooling, discharge the material to obtain the modified bisphenol A epoxy resin. The epoxy equivalent weight of the product was 805 g / eq.
Embodiment 2
[0037] Embodiment two: a kind of modified bisphenol A type epoxy resin and preparation method thereof
[0038] Accurately weigh 500 grams (g) of D.E.R 383 epoxy resin and 405 grams (g) of eicosadioic acid, stir and heat to 96°C under nitrogen protection, then add 0.5 grams (g) of triethanolammonium chloride, when The temperature of the reactant rises to 140-150°C; the reactant is kept at this temperature for 3.5 hours; after cooling, the material is discharged to obtain the modified bisphenol A epoxy resin. The epoxy equivalent weight of the product was 785 g / eq.
Embodiment 3
[0039] Embodiment three: a kind of modified bisphenol A type epoxy resin and preparation method thereof
[0040]Accurately weigh 500 grams (g) of EPIKOTE 828EL epoxy resin and 415 grams (g) of eicosadioic acid, stir and heat to 98°C under nitrogen protection, then add 0.8 grams (g) of triphenylethyl iodide Phosphonium, when the temperature of the reactant rises to 140-150°C; keep the reactant at this temperature for 2 hours; after cooling, discharge the material to obtain the modified bisphenol A epoxy resin. The epoxy equivalent weight of the product was 780 g / eq.
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