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Dicing die-bonding film

A chip bonding film and cutting film technology, which is applied in the fields of film/sheet adhesive, thin material processing, semiconductor/solid device manufacturing, etc., can solve problems such as difficult to achieve uniform adhesive layer, and achieve excellent moisture resistance and reliability , The effect of preventing reflow soldering cracking

Inactive Publication Date: 2013-02-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to achieve uniformity of the adhesive layer in this method, and the application of the adhesive requires a special device and a long time.

Method used

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  • Dicing die-bonding film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0071] The acrylic polymer can be produced by applying a suitable method such as solution polymerization, emulsion polymerization, bulk polymerization or suspension polymerization to one component monomer or a mixture of two or more component monomers. From the viewpoint of preventing wafer contamination, etc., the adhesive layer preferably has a composition that suppresses the inclusion of low-molecular-weight substances. From this point of view, an acrylic polymer having a weight average molecular weight of 300,000 or more, especially 400,000 to 3 million is preferable. As the main component, the binder may be of an appropriate crosslinking type such as internal crosslinking or external crosslinking.

[0072] In addition, in order to control the crosslinking density of the adhesive layer 2, for example, polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metal salt compounds, metal chelating agent compounds, amino resin compounds, etc. Co...

Embodiment 1

[0137] Preferred embodiments of the present invention are illustrated in detail below. In addition, the present invention is not limited to these Examples.

Embodiment 1）

[0139] [Manufacturing of Die Bonding Film]

[0140] 100 parts by weight of an acrylate polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Paraclon W-197CM), 3 parts by weight of a polyfunctional isocyanate crosslinking agent, 23 parts by weight Epoxy resin (Epicoat 1004, manufactured by Japan Epoxy Resin Co., Ltd.) and 6 parts by weight of phenolic resin (Milex XLC-CC, manufactured by Mitsui Chemicals Co., Ltd.) were dissolved in methyl ethyl ketone to prepare an adhesive composition with a concentration of 20% by weight. solution.

[0141] Then, the solution of the adhesive composition was applied to a release-treated film composed of a polyethylene terephthalate film (thickness 50 μm) after a silicone release treatment as a release liner. . It was then dried at 120° C. for 3 minutes. Thus, a die-bonding film A having a thickness of 25 μm was produced on the release-treated film.

[0142] [Manufacturing of cutting fil...

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Abstract

Provide is a dicing die-bonding film that prevents the occurrence of reflow cracking and that is capable of manufacturing a semiconductor device having excellent reliability with good productivity. The dicing die-bonding film of the present invention comprises at least: a dicing film in which a pressure-sensitive adhesive layer is provided on a support base material; and a die-bonding film that is provided on the pressure-sensitive adhesive layer, wherein the dicing die-bonding film has a water absorption rate of 1.5% by weight or less calculated from the following formula (1). [Numerical Formula 1] [(M2-M1) / M1]*100=Water absorption rate(% by weight) (1) (wherein, M1 represents the initial weight of the dicing die-bonding film, and M2 represents the weight after the dicing die-bonding film is left under an atmosphere of 85 DEG C and 85% RH for 120 hours to absorb moisture.)

Description

technical field [0001] The present invention relates to a dicing / die-bonding film used, for example, in a method of manufacturing a semiconductor device. Background technique [0002] In a conventional method of manufacturing a semiconductor device, a semiconductor wafer on which a circuit pattern is formed is diced into semiconductor chips after being adjusted in thickness by back grinding as necessary (dicing process). In this cutting process, in order to cool and prevent chips from flying, cutting water is generally sprayed (usually, the hydraulic pressure is about 2kg / cm 2 ) to carry out this process. [0003] Then, after the semiconductor chip is fixed (mounted) to an adherend such as a lead frame with an adhesive, the process proceeds to a die bonding step. In the mounting step, an adhesive is applied to the lead frame and the semiconductor chip. However, in this method, it is difficult to achieve uniformity of the adhesive layer, and application of the adhesive req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00C09J4/02C09J4/06H01L21/683C09J7/20
CPCH01L2924/01015H01L24/85H01L24/83H01L24/29H01L2924/15747C09J7/02C09J133/00H01L2224/45124C09J2203/326C09J2201/36C09J2201/122C09J2201/622H01L2224/45147H01L2924/10253H01L24/45H01L2224/45144H01L21/683H01L2224/85207H01L2224/92247H01L2224/83191H01L2924/01029C09J4/06H01L2224/48247H01L2924/01012H01L21/6836H01L24/27H01L2924/3025H01L2924/15788H01L2924/181H01L2924/12042H01L24/48C09J7/20Y10T428/2848C09J2301/208C09J2301/122C09J2301/312H01L2924/3512H01L2924/00H01L2924/00014H01L2924/20103H01L2924/20104H01L2924/20105H01L2924/20106H01L21/30
Inventor 松村健
Owner NITTO DENKO CORP
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