Elastic bicomponent normal-temperature cured epoxy resin adhesive and preparation method thereof

An epoxy resin, curing technology at room temperature, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low bonding strength and limited use of silicone sealants, and achieve excellent medium resistance and aging resistance Excellent performance, good elasticity and high bonding strength

Active Publication Date: 2013-02-20
HUNAN MAGPOW ADHESIVE INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive strength of silicone sealant is low, so

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Preparation of component A

[0025] In the kneader with temperature adjustment device and vacuum device, add 40 parts of polyurethane modified epoxy resin NPER-133L, 20 parts of bisphenol F epoxy resin NPEF-170, start the kneader, add 15 parts of nano calcium carbonate, Knead and stir for 60 minutes, add 2 parts of coupling agent KH-560, 3 parts of polypropylene fiber with a length of 3 mm, knead and stir for 60 minutes, add 20 parts of diethylene glycol diglycidyl ether, close the cylinder head of the kneader, and start the vacuum pump , evacuated to -0.06MPa, kneaded and stirred for 2 hours under the control temperature of 40~50°C, stopped the kneading and stirred, and discharged and packaged to obtain component A.

[0026] Preparation of Component B

[0027] ① Preparation of modified amine

[0028] In the reaction kettle with a stirring device and a temperature regulating system, first add 85 parts of isophorone diamine, start stirring, control the temperature at 3...

Embodiment 2

[0032] Preparation of component A

[0033] 30 parts of polyurethane modified epoxy resin NPER-133L, 30 parts of bisphenol F epoxy resin NPEF-170, 20 parts of hexanediol diglycidyl ether, and the dosage and preparation method of the remaining raw materials are the same as in Example 1.

[0034] Preparation of Component B

[0035] Formula and preparation process are with embodiment 1.

Embodiment 3

[0037] Preparation of component A

[0038] Raw material proportioning and preparation method are the same as embodiment 1.

[0039] Preparation of Component B

[0040] ① Preparation of modified amine

[0041] In the reaction kettle with stirring device and temperature adjustment system, first add 142 parts of 1,3-cyclohexanedimethylamine, start stirring, control the temperature at 30~40°C, add 50.5 parts of butanediol diglycidyl ether, and gradually raise the temperature To 60~80°C, keep warm for 2 hours, add 230 parts of ether amine D-230, stir for 30 minutes, within 0.5 hours, evenly add 101 parts of butanediol diglycidyl ether, keep warm at 60~80°C for 4 hours, cooling and discharging to obtain modified amine;

[0042] ②Preparation of component B

[0043] In the kneader with temperature adjustment device and vacuum device, add 80 parts of modified amine curing agent, start the kneader, add 10 parts of nano-calcium carbonate, knead and stir for 60 minutes, add 3 parts of...

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PUM

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Abstract

The invention relates to an elastic bicomponent normal-temperature cured epoxy resin adhesive and a preparation method thereof. The component A of the epoxy resin adhesive is prepared from polyurethane-modified epoxy resin, bisphenol F epoxy resin, aliphatic polyglycidyl ether, inorganic nanopowder materials, polypropylene fiber and a coupling agent; and the component B of the epoxy resin adhesive is prepared from modified amine hardener, an accelerant, a coupling agent, inorganic nanopowder materials and polypropylene fiber. The epoxy resin adhesive has the characteristics of room-temperature curing, good elasticity of a cured adhesive layer, good bonding strength, cold and thermal shock resistances and the like.

Description

technical field [0001] The invention relates to a two-component room temperature curing elastic epoxy resin adhesive, in particular to a high-strength elastic sealing adhesive modified epoxy adhesive and a preparation method thereof. Background technique [0002] Epoxy resins, phenolic resins and unsaturated polyester resins are known as the three general-purpose thermosetting resins. They are the largest and most widely used varieties of thermosetting resins. Epoxy resins contain unique epoxy groups, active groups such as light groups and ether bonds, and polar groups, so they have many excellent properties. Compared with other thermosetting resins, there are many types and grades of epoxy resins with different properties. There are more types of epoxy resin curing agents, coupled with numerous accelerators, modifiers, additives, etc., can be combined and assembled in a variety of ways. In this way, various epoxy curing systems and cured products with excellent performan...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J175/04C09J11/04
Inventor 袁媛刘辉
Owner HUNAN MAGPOW ADHESIVE INDS
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