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Chemical nickel-plating process of glass-to-metal sealing wire holder

A technology of electroless nickel plating and metal wiring, applied in metal material coating process, superimposed layer plating, coating and other directions, can solve the problem of rapid self-decomposition of process bath, high nickel plating repair rate of parts, low production efficiency, etc. problems, to achieve the effect of simple process maintenance, high repair rate and scrap rate, and low cost

Inactive Publication Date: 2013-02-20
成都泛华航空仪表电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The instability of the solution is the biggest shortcoming of the traditional electroless nickel plating process, and there are defects such as fast self-decomposition and rapid failure of the process bath, high repair rate of parts nickel plating, and low production efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The pretreatment is carried out according to the above conventional electroplating of metal parts. The method of electroplating cadmium is carried out according to the cyanide cadmium plating process (including dehydrogenation and secondary passivation of triacid). Electroless nickel plating solution by:

[0040] Nickel sulfate 25g / L, sodium hypophosphite 25g / L, citrate 20g / L, lead acetate 5mg / L, thiourea 5mg / L, sodium acetate 20g / L content preparation. The working temperature of the electroless nickel plating bath for the glass-sealed metal terminal block is 90-95°C, the pH value is 5-6, and the time is 40 minutes.

[0041] Visually inspect the appearance of the cadmium plating layer: the crystallization of the plating layer is fine and uniform, and the tri-acid secondary passivation film is iridescent from yellow-green to golden yellow.

[0042] Bonding force between the coating and the substrate: Clamp the test piece on the vise, file the edge of the coating with a...

Embodiment 2

[0046] The pretreatment is carried out according to the above conventional electroplating of metal parts. The method of electroplating cadmium is carried out according to the cyanide cadmium plating process, including dehydrogenation and secondary passivation of triacid. Electroless nickel plating solution by:

[0047] Nickel sulfate 20g / L, sodium hypophosphite 15g / L, citrate 12g / L, lead acetate 2mg / L, thiourea 3mg / L, sodium acetate 12g / L content preparation. The working temperature of the electroless nickel plating bath for the glass-sealed metal terminal block is 85-90°C, the pH value is 5-6, and the time is 50 minutes.

[0048] Visually inspect the appearance of the cadmium plating layer: the crystallization of the plating layer is fine and uniform, and the tri-acid secondary passivation film is iridescent from yellow-green to golden yellow.

[0049] Bonding force between the coating and the substrate: Clamp the test piece on the vise, file the edge of the coating with a ...

Embodiment 3

[0053] The pretreatment is carried out according to the above conventional electroplating of metal parts. The method of electroplating cadmium is carried out according to the cyanide cadmium plating process, including dehydrogenation and secondary passivation of triacid. Electroless nickel plating solution by:

[0054] Nickel sulfate 15g / L, sodium hypophosphite 10g / L, citrate 5g / L, lead acetate 1mg / L, thiourea 1mg / L, sodium acetate 5g / L. The working temperature of the electroless nickel plating bath for the glass-sealed metal terminal block is 85-90°C, the pH value is 5-6, and the time is 60 minutes.

[0055] Visually inspect the appearance of the cadmium plating layer: the crystallization of the plating layer is fine and uniform, and the tri-acid secondary passivation film is iridescent from yellow-green to golden yellow.

[0056] Bonding force between the coating and the substrate: Clamp the test piece on the vise, file the edge of the coating with a rough file, the file a...

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PUM

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Abstract

The invention discloses a chemical nickel-plating process of a glass-to-metal sealing wire holder. The chemical nickel-plating process mainly includes: (a) organic solvent unoiling; (b) acid washing; (c) protection glue coating; (d) electrochemical uncoiling; (e) chemical nickel plating: the glass-to-metal sealing wire holder after being processed through the steps is placed in a chemical nickel plating solution containing nickel ion salts, reducing agents, complexing agents, stabilizing agents, brightening agents and buffering agents for oxidation-reduction reaction and is deposited with metallic nickel; and (f) activating and cyanide cadmium plating after chemical nickel plating. The chemical nickel-plating process is simple and practical, bath solution can be adjusted and controlled easily, solution is fast in deposition velocity and good in chemical stability, and the chemical nickel-plating process is long in service life and low in cost. The chemical nickel-plating process solves problems of the traditional process that the partial inner surface of a deep blind hole cannot be plated with nickel, three-proof performance is unqualified, insulation and air tightness of the wire holder are reduced after electroplating, and product parts are low in qualified rate and high in repair rate and rejection rate; and improves product quality and reduces production cost.

Description

[0001] technical field [0002] The present invention relates to a process method of electroless nickel plating on a glass-sealed metal terminal block. The electroless nickel-plating process on a glass-sealed metal terminal block involved in the description of the present invention is not limited to the electroless nickel plating on this type of metal terminal block. It is suitable for electroless nickel plating on the surface of other metal parts with self-catalytic activity. Background technique [0003] In the prior art, due to the influence of factors such as the shielding of the power line, the uneven distribution of blocking formation, and the rapid local change of the electroplating bath solution in the deep blind hole, the ideal electroplating layer must be obtained on the surface of the metal inner wall in the deep blind hole. It is extremely difficult, especially when the diameter of the deep blind hole is small and deep, it is basically impossible to obtain an ele...

Claims

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Application Information

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IPC IPC(8): C23C18/34C23C18/18C25D3/28C25D7/04C23C28/02
Inventor 蒋应洪
Owner 成都泛华航空仪表电器有限公司