Method for connecting glass with copper or copper alloy
A connection method and copper alloy technology, which is applied in the field of connection between glass and copper or copper alloy, can solve the problems of low joint quality, complicated process, high connection temperature, etc., and achieve the effects of simple fixture, energy saving, and easy brazing process
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specific Embodiment approach 1
[0016] Specific implementation mode one: (please refer to the attached figure 1 ) The connection method between glass and copper or copper alloy in this embodiment is implemented according to the following steps:
[0017] 1. Put the polished copper or copper alloy into acetone and ultrasonically clean it for 8 to 15 minutes, then wash it with absolute ethanol and deionized water respectively, dry it and put it in a drying oven to dry it to obtain the surface-treated copper or copper alloy;
[0018] 2. Put the polished glass substrate into acetone and ultrasonically clean it for 8 to 15 minutes, then wash it with absolute ethanol and deionized water respectively, and dry it to obtain the cleaned glass substrate. Use ion beam bombardment to clean the glass substrate. 3 to 5 minutes, and then on the glass substrate, a Cr film with a thickness of 250 to 350 nm is evaporated on the glass substrate, and then a Cu film with a thickness of 700 to 900 nm is evaporated to obtain a coat...
specific Embodiment approach 2
[0028] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the copper or copper alloy after step one is polished with silicon carbide water sandpaper, and the polishing process is to use 80# sandpaper successively, 240# silicon carbide water sandpaper, 400 #Sandpaper, 600# sandpaper, 800# sandpaper, 1000# sandpaper are polished step by step. Other steps and parameters are the same as those in Embodiment 1.
specific Embodiment approach 3
[0029] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the glass substrate polished in step 2 is polished with #80 silicon carbide water sandpaper. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
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