Epoxy/organosilicon co-curing composite material for LED packaging and preparation method

A technology of LED packaging and composite materials, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as high tension and poor compatibility

Active Publication Date: 2013-03-20
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using the above-mentioned silicone-modified epoxy resin method, if the packaging material is prepared by adding silicone or single-phase epoxy curing alone, due to the excessive inte

Method used

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  • Epoxy/organosilicon co-curing composite material for LED packaging and preparation method
  • Epoxy/organosilicon co-curing composite material for LED packaging and preparation method
  • Epoxy/organosilicon co-curing composite material for LED packaging and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] (1) Preparation of epoxy hydrocyclosiloxane

[0062] Add 1.0mol (240.5g) tetramethylhydrocyclotetrasiloxane (Beijing Huawei Raycus Chemical Co., Ltd.), 2.0mol (248.4g ) 4-vinyl epoxycyclohexane and 400ml of toluene, after argon gas was introduced for 20 minutes, stirred at room temperature, refluxed at 110°C for 1 hour, cooled naturally to room temperature and then heated to 70°C, and 3.1ml was added dropwise after the temperature was constant Concentration is the isopropanol solution of chloroplatinic acid of 0.0125g / ml as catalyst, react 6h after completion of dropwise addition, after the completion of reaction, remove solvent by rotary evaporation, obtain colorless and transparent epoxy group hydrogen-containing cyclosiloxane;

[0063] (2) Preparation of phenyl vinyl silicone resin

[0064] Add 1mol (248.4g) 3-(methacryloyloxy)propyltrimethoxysilane and 0.42g catalyst KI into a round bottom flask equipped with a stirrer, reflux condenser, and thermometer, and stir e...

Embodiment 2

[0068] (1) Preparation of epoxy hydrocyclosiloxane

[0069] Add 1.0 mol (360.8 g) hexamethylhydrocyclohexasiloxane C to a round bottom flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port 6 h 18 o 6 Si 6 (Kingston Chemical), 5.0 mol (621.0 g) 4-vinylepoxycyclohexane CH 2 =CHC 6 h 9 O and 4900ml of 4-methyl-2-pentanone, after passing argon gas for 30min, stir evenly at room temperature, reflux at 120°C for 0.5h, cool to room temperature naturally, then gradually raise the temperature to 90°C, and slowly add 20.9 The dicyclopentadiene platinum dichloride ethanol solution with a concentration of 0.0125g / ml was used as a catalyst, and reacted for 3 hours after the dropwise addition was completed. After the reaction was completed, the solvent was removed by rotary evaporation to obtain a colorless and transparent epoxy hydrogen-containing ring Silicone;

[0070] (2) Preparation of phenyl vinyl silicone resin

[0071] With 0.1mol (20.4g) allyltriet...

Embodiment 3

[0075] (1) Preparation of epoxy hydrocyclosiloxane

[0076] Add 1.0 mol (480.4 g) octamethylhydrocyclopentasiloxane C to a round bottom flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port 8 h 24 o 8 Si 8 (Kingston Chemical), 7.0 mol (798.7 g) allyl glycidyl ether CH 2 ═CHCH 2 OCH 2 CHCH 2 O and 1000ml of ethylene glycol dimethyl ether, after passing argon gas for 10 minutes, stir evenly at room temperature, reflux at 85°C for 2h, cool to room temperature naturally, then gradually heat up to 80°C, and slowly add 0.27ml concentration after the temperature is constant The isopropanol solution of chloroplatinic acid of 0.0125g / ml was used as a catalyst, and after the dropwise addition was completed, it was reacted for 12h. After the reaction was completed, the solvent was removed by rotary evaporation to obtain a colorless and transparent epoxy hydrogen-containing cyclosiloxane;

[0077] (2) Preparation of phenyl vinyl silicone resin

[0078] 1m...

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Abstract

The present invention discloses an epoxy/organosilicon co-curing composite material for LED packaging and a preparation method. The epoxy/organosilicon co-curing composite material of the present invention comprises the following components by weight: 50-500 parts of epoxy hydrogen-containing cyclosiloxane, 0-10 parts of an antioxidant, 0-10 parts of an ultraviolet absorber, 0-15 parts of a light scattering agent, 100 parts of phenyl vinyl silicone resin, 0.5-15.0 parts of an epoxy curing agent, and 0.01-1.0 part of a silicon hydrogen addition curing catalyst. The present invention combines two curing ways of epoxy cationic curing and organosilicon silicon hydrogen addition curing, through the curing reaction of epoxy and silicone to prepare the epoxy/organosilicon co-curing composite material with epoxy and organosilicon interpenetrating cross-linked network structure. The epoxy/organosilicon co-curing composite material has the characteristics of an epoxy resin and an organosilicon material, and has the performances of excellent light transmittance, adhesion, mechanical strength, heat resistance and UV resistance. The preparation process of the present invention is simple, raw materials are easily available, and practicability is high.

Description

technical field [0001] The invention belongs to the technical field of preparation of sealing materials for optical semiconductor components, and in particular relates to an epoxy / organic silicon co-curing composite material for LED packaging and a preparation method thereof. Background technique [0002] LED (light-emitting diode) is a semiconductor light-emitting device that converts electrical energy into light energy. It has the advantages of energy saving and environmental protection, small size, long life, low operating voltage, and short switching time. As a new type of lighting technology, it can be widely used in landscape lighting, automobile market, traffic light market, outdoor large-screen display and special work lighting and other fields. At present, it is developing in the direction of high brightness, high color, high weather resistance, and high uniformity of light emission. With the continuous progress and maturity of LED technology, LED is expected to re...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L83/07C08G59/20C08G77/20H01L33/56
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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