Method for manufacturing lead frame

A manufacturing method and technology for lead brackets, which are applied to electrical components, circuits, electric solid devices, etc., can solve the problems of fine dispersion of precipitates, unsatisfactory comprehensive properties of copper-iron alloys for lead brackets, and uneven structure of alloys, and achieve precipitation. The effect of fine phase dispersion, excellent hot workability and low alloy price

Active Publication Date: 2014-07-30
JIANGSU JINYUAN FORGE
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Problems solved by technology

[0005] The invention provides a method for manufacturing a lead frame, especially a method for manufacturing a copper-iron alloy for a lead frame. The method can effectively solve the problem that the comprehensive performance of the copper-iron alloy for a lead frame does not meet the production requirements, the structure of the alloy is not uniform, and the precipitates are finely dispersed. and other problems, the tensile strength, hardness, elongation, electrical conductivity and softening temperature of the copper-iron alloy prepared by the manufacturing method of the present invention can better meet many requirements of the electronic industry field on the performance of the lead frame material

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Embodiment

[0047] The copper-iron alloy No. 1~6 of composition (wt%) shown in table 1,

[0048] Table 1

[0049]

[0050] It is worth noting that during the melting process of the alloy, each element has different degrees of burning loss, and the burning loss rate is Fe: 1-2%, Ti: 1-3%, B: 2-5%, Na: 20 ~30%, Mo: 30~50%; it should be supplemented during the batching process. At the beginning of smelting, add electrolytic copper and copper-iron intermediate alloy first, start heating, and after it melts, add 1 / 3 of copper-boron intermediate alloy and keep it warm for 1 to 3 minutes; then add titanium, sodium and rare earth, and keep it warm for 3 minutes after melting ~5min, then add the remaining 2 / 3 of the copper-boron intermediate alloy, and cast it with heat preservation for 10min after full melting; use a small vertical semi-continuous casting machine to cast a billet of 70×180×1000 (mm), and use the billet mold for one cooling and Water shower is used for secondary cooling, so t...

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Abstract

The present invention discloses a method for manufacturing a lead frame, comprising the following steps: melting, injecting into a blank mold, cooling; hot rolling and calendaring the casting blank; repeatedly cold rolling and calendaring, and two-stage continuous annealing hot rolled strips; cold rolling processing to make the variation of thickness be above 40%, and then low-temperature annealing to obtain the finished strips. In the manufacturing process, the component content is controlled including 2.0-2.6 wt% of Fe, 0.05-0.1 wt% of Ti, 0.01-0.03 wt% of B, 0-0.05 wt% of Na, 0.01-1.5 wt% of Mo, the balance being Cu and impurities. The strip is used to manufacture the lead frame. According to the present invention, the copper iron alloy structure is homogeneous, and precipitated phase is fine and dispersed. The finished product is high in tensile strength, hardness, conductivity, and elongation, and can meet the demands of the electronics industry on the performance of the lead frame material. The lead frame of the invention uses copper iron alloy, thereby also having excellent hot workability.

Description

technical field [0001] The invention relates to a method for manufacturing a lead frame, in particular to a method for manufacturing a lead frame used for semiconductor devices. Background technique [0002] At present, the electronic information industry has become an important pillar industry in my country. As the cornerstone of this pillar industry, semiconductor devices include external packaging and internal integrated circuits; integrated circuits (IC) include chips, leads and lead brackets, adhesive materials, packaging materials etc. Among them, the main function of the lead frame is to provide a mechanical support carrier for the chip, and it also has the functions of connecting external circuits, transmitting electrical signals, and dissipating heat. Therefore, IC packaging needs to have comprehensive properties such as high strength, high electrical conductivity, high thermal conductivity, and good solderability, corrosion resistance, plastic sealing, and oxidatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22F1/08H01L23/495
CPCH01L2924/0002
Inventor 葛艳明袁志伟
Owner JIANGSU JINYUAN FORGE
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