Method for manufacturing copper-iron alloy used for lead frame

Abstract

The present invention discloses a method for manufacturing copper-iron alloy used for lead frame, comprising the following steps: melting, injecting in a blank mold, cooling; hot rolling and calendaring the casting blank; repeatedly cold rolling and calendaring, and two-stage continuous annealing hot rolled strips; cold rolling processing to make the variation of thickness be above 40%, and then low-temperature annealing to obtain the finished strips. In the manufacturing process, the component content is controlled including 2.0-2.6 wt% of Fe, 0.05-0.1 wt% of Ti, 0.01-0.03 wt% of B, 0-0.05 wt% of Na, 0.01-1.5 wt% of Mo, the balance being Cu and impurities. According to the present invention, the copper iron alloy structure is homogeneous, and the precipitated phase is fine and dispersed. The finished product is high in tensile strength, hardness, conductivity, and elongation, and can meet the demands of the electronics industry on the performance of the lead frame material. The copper iron alloy has excellent hot workability, and is a best material for the production of the lead frame and other electrical and electronic components.

Description

technical field [0001] The invention relates to a method for manufacturing an alloy, in particular to a method for manufacturing an alloy used for manufacturing a lead frame. Background technique [0002] At present, the electronic information industry has become an important pillar industry in my country. As the cornerstone of this pillar industry, semiconductor devices include external packaging and internal integrated circuits; integrated circuits (IC) include chips, leads and lead brackets, adhesive materials, packaging materials etc. Among them, the main function of the lead frame is to provide a mechanical support carrier for the chip, and it also has the functions of connecting external circuits, transmitting electrical signals, and dissipating heat. Therefore, IC packaging needs to have comprehensive properties such as high strength, high electrical conductivity, high thermal conductivity, and good solderability, corrosion resistance, plastic sealing, and oxidation r...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for manufacturing copper-iron alloy for lead brackets, which can effectively solve the problems that the comprehensive performance of copper-iron alloy for lead brackets does not meet the production requirements, the structure of the alloy is uneven, and the precipitates are finely dispersed. The manufacturing method of the invention is adopted The tensile strength, hardness, elongation, electrical conductivity and softening temperature of the prepared copper-iron alloy can better meet the requirements of the electronic industry for the performance of lead frame materials.

Images