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Surface chemical nickel-plating silica sol and preparation method thereof

A surface chemistry, silica sol technology, used in new materials, electronic materials, and chemical fields, can solve the problems of few types of conductive polymers, limited applications, high density and easy deposition of metal/metal composite materials, etc., to enhance mechanical properties, reduce Dosage, Density Reduction Effect

Inactive Publication Date: 2015-01-14
武汉今福科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal / metal composite, metal / nonmetal composite, conductive polymer / nonmetal composite and other methods are adopted by researchers, but the problems of high density and easy deposition of metal / metal composite materials are difficult to solve. There are few types of conductive polymers in composite systems, which limit their applications

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1000g of tetramethoxysilane, 10g of aminopropyltrimethoxysilane and 1000g of methanol were added to the reaction flask, and the temperature was controlled between -20°C and -15°C. Under constant stirring, a mixture of 300g of water and methanol was added dropwise. The dropwise addition time of the mixed solution (the mass content of water is 90%) is controlled at 5h, and after the dropwise addition is completed, the temperature is raised to room temperature for 1h to obtain amine-containing silica sol on the surface. The above silica sol was subjected to a solvent exchange operation on an ultrafiltration device (membrane unit pore size 0.02 μm), and a large amount of water was added for ultrafiltration, so that methanol continuously overflowed through the membrane pores, thereby replacing the methanol in the sol with water. If the content is less than 0.05wt.%, control ultrafiltration to feed water, concentrate the hydrosol to 1600mL, make the solid content be 30wt.%, an...

Embodiment 2

[0023] 1000g of tetramethoxysilane, 10g of N-aminoethylaminopropyltrimethoxysilane and 2000g of methanol were added to the reaction flask, the temperature was controlled at about 45°C, and under constant stirring, a mixture of 3000g of water and methanol was added dropwise. liquid (the mass percentage of water is 10%), the dropwise addition time is controlled at 0.5h, after the dropwise addition, the reaction is carried out at 45°C for 20h to obtain methanol-type surface amine-containing silica sol with a solid content of 6.7wt.%.

[0024] The above silica sol is subjected to a solvent exchange operation on an ultrafiltration device (membrane unit pore size 0.002 μm), and a large amount of water is added for ultrafiltration, so that methanol continuously overflows through the membrane pores, thereby replacing the methanol in the sol with water to obtain an aqueous silica sol. . At the end of the ultrafiltration process, the methanol content was lower than 0.05 wt.%, and the fe...

Embodiment 3

[0029]Add 1000g tetraethoxysilane and 500g aminopropyl triethoxysilane to the reaction flask, control the temperature at 80°C, and under constant stirring, add dropwise the mixed solution of 500g water and ethanol (the mass percentage of water is 50%), the dripping time was controlled at 5h, and after the dripping was completed, the reaction was refluxed for 2h to obtain an ethanol-type surface amine-containing silica sol with a solid content of 26.4wt.%.

[0030] The above-mentioned silica sol is subjected to a solvent exchange operation on an ultrafiltration device (membrane unit pore size 0.02 μm), and ultrafiltration is performed by adding a large amount of water, so that ethanol continuously overflows through the membrane pores, thereby replacing the ethanol in the sol with water to obtain an aqueous silica sol. . The ethanol content was less than 5 wt.% at the end of the ultrafiltration process. The ultrafiltration water was controlled, and the hydrosol was concentrated...

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Abstract

The invention discloses a surface chemical nickel-plating silica sol and a preparation method thereof. Firstly, monomers such as alkoxy silane (including methoxysilane or ethoxysilane) and the like are used as raw materials, the raw material ratio is adjusted, appropriate reaction temperature and polymerization time are controlled to perform processes of alcoholysis reaction, hydrolysis reaction, polycondensation reaction and the like to obtain silica sols with different particle sizes, then the silica sols are activated through AgNO3, a layer of metallic nickel is plated on the surface of silica by a nickel contained chemical plating solution, and an electrical conductivity is endowed on silica particles. The surface nickel-plating silica sol particles can be applied to industries for preparation of electromagnetic shielding coating, conducting polymers and the like.

Description

technical field [0001] The invention relates to a silica sol with chemical nickel plating on the surface and a preparation method thereof, belonging to the technical fields of chemical industry, new materials and electronic materials. Background technique [0002] With the rapid development of information technology, the transmission of electromagnetic signals is an important process of information transmission in computer networks, information processing equipment, electronic communication equipment and various electrical equipment. Due to the miniaturization and high integration of electronic components and the lightweight, high-speed and digitization of electronic instruments and meters, the transmission of electromagnetic signals is more and more susceptible to external electromagnetic interference and distortion. Therefore, various effective protective measures must be taken to ensure effective electromagnetic signals. transmission. In addition, the electromagnetic wav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/32
Inventor 黄荣华李杨
Owner 武汉今福科技有限公司