Electric grinding multi-line cutting current inlet method and device

A multi-wire cutting and electric grinding technology, applied in the direction of fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of complex operation, cumbersome process methods, complex process methods, etc., to increase complexity and cost, The effect of simplifying the structure

Inactive Publication Date: 2013-04-24
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process method is complicated to operate, and special metal electrodes are needed to realize the power supply, and an additional electrolysis power supply i

Method used

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  • Electric grinding multi-line cutting current inlet method and device
  • Electric grinding multi-line cutting current inlet method and device
  • Electric grinding multi-line cutting current inlet method and device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0037] Example 1

[0038] Such as Figure 1 ~ Figure 4 Shown.

[0039] (1) Install the magnetic field generator 1 in the cutting chamber of the multi-wire cutting machine. The magnetic field generator 1 can be fixed by bolt connection or screw connection. The direction of the magnetic field can be set according to the actual situation. The purpose is to make the cutting line 3 in During movement, induced electromotive force can be generated on both sides of the cross section of the cutting line 3. In this embodiment, the direction of the magnetic field is perpendicular to the moving direction of the cutting line 3 and parallel to the feeding direction of the cutting line 3. The applied magnetic field can be generated by permanent magnets or electromagnets. The intensity of the applied magnetic field can be adjusted to ensure that the induced electromotive force can be adjusted to deal with the processing of materials with different resistivities under the condition of the same wi...

Example Embodiment

[0048] Example 2

[0049] Such as Figure 5 with Image 6 As shown, the difference from Embodiment 1 is that the angle between the direction of the magnetic field and the feed direction of the cutting line is 45°.

[0050] In this embodiment, the equivalent circuit diagram of the processing process is as Image 6 Shown.

[0051] Specifically, the A1D1C1B1 area is the workpiece to be processed, A2D2 is an area on the left of the cutting line, and B2C2 is an area on the right of the cutting line. The cutting line 3 moves inward along its axis perpendicular to the paper surface. An induced electromotive force is generated on the cutting line 3, B2C2 is the positive electrode, and A2D2 is the negative electrode. A1D1 and A2D2 contact each other through a small gap to form a loop, and B1C1 and B2C2 also contact each other through a small gap to form a loop. The A1D1 area is the anode of the electrochemical reaction, and anode passivation occurs to form a passivation film.

[0052] In th...

Example Embodiment

[0054] Example 3

[0055] The difference from embodiment 1 is that in this embodiment, the diameter of the cutting line 3 is 100 μm, the linear speed of the cutting line 3 is 100 m / min, and the feed speed can be adjusted according to the processing conditions, and can be controlled between 200 and 500 μm / min; The composition of the cutting fluid: silicon carbide abrasive grains and polyethylene glycol are in a mass ratio of 0.8:1, the particle size of the silicon carbide abrasive is controlled to be less than 20μm, and the cutting fluid flow rate is 100kg / min.

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Abstract

The invention provides an electric grinding multi-line cutting current inlet method and device in the field of interdisciplines, belongs to the field of semiconductor silicon wafter cutting processing and relates to professional knowledge in the crossing field of non-traditional machining, automatic control, electrician electron and the like. The electric grinding multi-line cutting current inlet method includes: performing grinding machining on machined workpieces through metal cutting lines on a multi-line cutting machine tool, spraying cutting liquid on a cutting area during maching, and exerting an electric field on a grinding area, wherein the direction of the magnetic lines of the electric field is crossed with the axial moving direction of the cutting lines. The electric grinding multi-line cutting current inlet device comprises the cutting lines and a machining workpiece and is characterized by further comprising a magnetic field generating device. The electric grinding multi-line cutting noncontact type current inlet method replaces electrical connection of electric grinding multi-line cutting, the structure of the whole process system is simplified, the machined workpieces are passivated by induced current of the electric field, and processing of the grinding machining is facilitated.

Description

[0001] technical field [0002] The invention belongs to the field of semiconductor silicon chip cutting and processing, more specifically, the invention relates to the field of mechanical grinding and electrolytic composite processing, and belongs to the category of special processing. The power feeding of auxiliary electrolytic reaction adopts a new non-contact power feeding method. The method and device involve interdisciplinary professional knowledge in special processing, automatic control, electrical and electronic disciplines, etc., and are an interdisciplinary invention patent. [0003] Background technique [0004] With the continuous development of related industries such as large-scale integrated circuits, computers, and solar cells, semiconductor materials are more and more widely used in modern industries. Silicon wafers are the main production raw materials in the semiconductor and photovoltaic industry chains, and the processing and manufacturing costs of sil...

Claims

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Application Information

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IPC IPC(8): B24B1/00B28D5/04
Inventor 周翟和鲍官培汪炜
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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