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Photosensitive composition, cured film formed from same, and element having cured film

A technology of photosensitive composition and cured film, which is applied in the field of photosensitive composition, cured film formed therefrom, and components with cured film, which can solve the problems of reduced electrode conductivity, insufficient heat resistance or chemical resistance , Cured film coloring, transparency reduction and other problems, to achieve the effect of excellent moisture resistance and high heat resistance

Active Publication Date: 2013-06-26
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] In addition, the acrylic resins used as materials described in Patent Documents 2, 3, and 4 have insufficient heat resistance and chemical resistance, and there are problems that various The coloring of the cured film and the decrease in transparency due to the treatment of an etching chemical solution, or the decrease in the conductivity of the electrode due to degassing during high-temperature film formation

Method used

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  • Photosensitive composition, cured film formed from same, and element having cured film
  • Photosensitive composition, cured film formed from same, and element having cured film
  • Photosensitive composition, cured film formed from same, and element having cured film

Examples

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Embodiment

[0171] Examples are given below to describe the present invention more specifically, but the present invention is not limited by these Examples. In addition, among the compounds used, the abbreviated compounds are as follows.

[0172] DAA: diacetone alcohol

[0173] PGMEA: Propylene Glycol Monomethyl Ether Acetate

[0174] GBL: gamma-butyrolactone

[0175] EDM: diethylene glycol methyl ethyl ether

[0176] DPM: dipropylene glycol monomethyl ether.

[0177] In addition, the solid content concentration of the polysiloxane solution and the acrylic resin solution, and the weight average molecular weight (Mw) of the polysiloxane and the acrylic resin were obtained as follows.

[0178] (1) Solid content concentration

[0179] 1 g of the polysiloxane solution or the acrylic resin solution was weighed in an aluminum cup, and heated at 250° C. for 30 minutes using a hot plate to evaporate the liquid component. The solid content remaining in the heated aluminum cup was weighed to ...

Synthetic example 1

[0190] Synthesis example 1: Synthesis of polysiloxane solution (A1-a)

[0191] Add 81.72 g (0.60 mol) of methyltrimethoxysilane, 59.49 g (0.30 mol) of phenyltrimethoxysilane, (2-(3,4-epoxycyclohexyl) ethyl trimethyl Oxysilane 24.64g (0.10 mol), DAA 163.1g, while stirring at room temperature, was added with 10 minutes in water 55.8g phosphoric acid 0.54g (0.3% by weight relative to the added monomer) of phosphoric acid aqueous solution. Then After immersing the flask in a 40°C oil bath and stirring for 30 minutes, the oil bath was heated to 115°C in 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100°C, and it was heated and stirred for 1.5 hours (within Temperature is 100~110 ℃), obtain polysiloxane solution (A1-a). It should be noted that, during heating and stirring, flow nitrogen at 0.05L (liter) / min. Methanol, water as by-products in the reaction A total of 131 g was distilled off.

[0192] The solid content ...

Synthetic example 2

[0193] Synthesis Example 2: Synthesis of polysiloxane solution (A1-b)

[0194] Add 54.48 g (0.40 moles) of methyltrimethoxysilane, 99.15 g (0.50 moles) of phenyltrimethoxysilane, (2-(3,4-epoxycyclohexyl) ethyl trimethyl Oxysilane 24.64g (0.10 mol), DAA 179.5g, while stirring at room temperature, was added with 10 minutes in water 55.8g phosphoric acid 0.54g (0.3% by weight relative to the added monomer) of phosphoric acid aqueous solution. Then After immersing the flask in a 40°C oil bath and stirring for 30 minutes, the oil bath was heated to 115°C in 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100°C, and thus heated and stirred for 2 hours (within Temperature is 100~110 ℃) to obtain polysiloxane solution (A1-b). It should be noted that, during heating and stirring, nitrogen gas was circulated at 0.05L (liter) / min. Methanol and water, which were by-products in the reaction, were A total of 121 g was distilled...

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Abstract

Provided is a positive photosensitive composition containing (A) an alkali-soluble resin, (B) a naphthoquinonediazide compound, (C) a solvent and (D) a metal chelate compound, which is characterized in that the (D) metal chelate compound has a structure represented by general formula (1) and the content of the (D) metal chelate compound is 0.1-5 parts by weight relative to 100 parts by weight of the (A) alkali-soluble resin. The positive photosensitive composition has characteristics such as high heat resistance and high transparency, while exhibiting excellent adhesion during development and excellent wet heat resistance.

Description

technical field [0001] The present invention relates to a flattening film for a thin-film transistor (TFT) substrate, a protective device film or an insulating film for a touch panel, an interlayer insulating film for a semiconductor element, and a flattening film for a solid-state imaging element, etc. A photosensitive composition of a chemical film or a microlens array pattern, or a core or cladding material of an optical waveguide, a cured film formed therefrom, and an element having the cured film. Background technique [0002] In recent years, liquid crystal displays, organic EL displays, and the like have been required to achieve higher definition and higher resolution. [0003] In addition, in recent years, touch panels have been actively used in liquid crystal displays, especially capacitive touch panels. In order to improve the transparency and functionality of touch panels, the high transparency and high conductivity of ITO as a transparent electrode component Fil...

Claims

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Application Information

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IPC IPC(8): G03F7/004G02F1/1333G03F7/023G03F7/075
CPCG03F7/0226G03F7/0233G03F7/0751C08K5/057G02F1/1333G03F7/004G03F7/038G03F7/039G03F7/075
Inventor 藤原健典诹访充史内田圭一福原将妹尾将秀
Owner TORAY IND INC
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