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Heat dissipation coating and preparation method

A heat-dissipating coating and raw material technology, applied in the direction of coating, etc., can solve the problems of lamp shell aging, LED service life decline, and can not meet the development status and requirements of LED lamps, etc., to increase high temperature resistance, strong adhesion, heat dissipation good effect

Inactive Publication Date: 2013-10-16
TIANCHANG JINLING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the general LED lamp does not adopt special heat dissipation measures, and uses the natural heat dissipation of the lamp housing. This method causes the lamp housing to age after the LED lamp has been used for a period of time. Due to the long-term high temperature of the lamp housing, the service life of the LED is reduced; it cannot meet Development Status and Requirements of LED Lamps

Method used

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Embodiment Construction

[0015] A heat-dissipating coating made from the following raw materials in parts by weight (kg):

[0016] Silicone resin 45, butyl acetate 22, ethyl acetate 24, nano silicon dioxide 14, nano titanium dioxide 8, aluminum nitride powder 22, corundum powder 5, dibutyl tin dilaurate 2, tributyl trichloride Tin 3, vinyl acetate 8, nano bauxite 14, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate 3, tetraethylenepentamine 1, salicylic acid 2, film former 5.

[0017] Described film-forming agent is made from the raw material of following parts by weight (kg):

[0018] Composition of raw materials Vanadium boride 4, Crosslinker TAC2 , ditetradecyl alcohol ester 5, cyclohexanone peroxide 1, styrene 4, acrylonitrile 2, xylene 10, propylene glycol 13; the preparation method is: crosslinking agent TAC , ditetradecyl alcohol ester mixed, added to xylene, stirred for 10-20 minutes, added cyclohexanone peroxide, stirred and reacted for 30-40 minutes, added styrene, stirred and reac...

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PUM

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Abstract

The invention provides a heat dissipation coating used for LED lights and a preparation method. The coating is characterized by comprising the following raw materials by weight parts: 40-45 parts of organic silicone resin, 18-22 parts of butyl acetate, 24-26 parts of ethyl acetate, 12-14 parts of nano-silica, 8-10 parts of nanometer titanium dioxide, 20-22 parts of aluminium nitride powder, 5-7 parts of emery powder, 1-2 parts of dibutyltin dilaurate, 2-3 parts of tributyl tin trichloride, 8-10 parts of vinyl acetate, 12-14 parts of nano bauxite, 3-5 parts of isopropyl tri(dioctyl pyrophosphate acyloxy) titanate, 1-2 parts of tetraethylenepentamine, 1-2 parts of salicylic acid, and 4-5 parts of a film forming agent. The emery powder provided in the invention is relatively high in melting point, thereby improving a high temperature resistance performance of the heat dissipation coating; the nanometer titanium dioxide has self-cleaning property, thereby helping to maintain a clean coating.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, more specifically, to a heat dissipation coating and a preparation method thereof. Background technique [0002] With the rapid expansion of the use of LED lamps, prolonging the service life of LED lamps has become an urgent problem to be solved. At present, the general LED lamp does not adopt special heat dissipation measures, and uses the natural heat dissipation of the lamp housing. This method causes the lamp housing to age after the LED lamp has been used for a period of time. Due to the long-term high temperature of the lamp housing, the service life of the LED is reduced; it cannot meet The development status and requirements of LED lamps. [0003] At the same time, there are many devices that need to be coated with heat-dissipating paint to help dissipate heat. Contents of the invention [0004] The object of the present invention is to prov...

Claims

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Application Information

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IPC IPC(8): C09D4/00C09D7/12C08F212/08C08F220/44
Inventor 茆文斌
Owner TIANCHANG JINLING ELECTRONICS
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