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Micro cooling device of silicon-substrate capillary pump loop

A technology of coolers and capillary pumps, applied in cooling/ventilation/heating transformation, instruments, circuits, etc., can solve problems such as excessive heat generation, uneven heating of microelectronic chips, and increased heat load of microelectronic chips, and achieve reduction Small working medium flow resistance, enhanced heat transfer and temperature control capability, and safe and reliable working performance

Inactive Publication Date: 2013-12-11
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the fact that the existing CPL heat pipe heat dissipation technology is difficult to solve the problem that the rapid increase of the working heat load of the microelectronic chip causes excessive heat generation and the uneven heat generation of the microelectronic chip itself will cause local "hot spots" on the surface. The present invention provides a silicon The micro-cooler based on the capillary pump circuit can directly and effectively reduce the temperature of the "hot spot" part of the chip through the silicon-based CPL, improve the heat dissipation and cooling efficiency, combine the characteristics of the CPL itself and the advantages of micro-scale heat transfer to enhance the heat transfer and temperature control ability, and make the microelectronics The working performance of the chip is safer and more reliable

Method used

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  • Micro cooling device of silicon-substrate capillary pump loop
  • Micro cooling device of silicon-substrate capillary pump loop
  • Micro cooling device of silicon-substrate capillary pump loop

Examples

Experimental program
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Embodiment 1

[0032] Such as figure 1 , image 3 As shown, a silicon-based capillary pump circuit micro-cooler is formed by bonding a pair of semiconductor silicon chips and a heat-resistant borosilicate glass sheet 11 and can be directly integrated with a semiconductor microelectronic chip. The surface of the silicon chip 1 in contact with the borosilicate glass sheet is etched with an evaporator 2, a condenser 3, a vapor phase channel 4, a liquid phase channel 5, a liquid storage chamber 6, and a vacuum / injection channel 9; the evaporator 2 The condenser 3 is connected by the vapor phase channel 4 and the liquid phase channel 5 to form a closed loop; the interior of the evaporator 2 includes tiny channels, and the condenser 3 includes a condensation microchannel 8; the condensation microchannel 8 is etched along the flow direction of the condensate The borosilicate glass sheet 11 is processed with a vacuum / liquid injection hole 12; the vacuum / liquid injection hole 12 corresponds to the ...

Embodiment 2

[0037] Such as figure 2 , image 3 As shown, it is the same as Embodiment 1, except that the evaporator 2 of the capillary pump circuit is not the micro-rib array capillary structure 7 described in Embodiment 1, but an evaporation microchannel 10 similar to the condenser 3 .

Embodiment 3

[0039] With embodiment 1, embodiment 2, the difference is that the cross-sectional dimensions of the vapor phase channel 4 and the liquid phase channel 5 in the silicon-based capillary pump circuit micro cooler change linearly along the channel direction, wherein the vapor phase channel 4 is from the evaporator 2 The direction of the condenser 3 increases linearly, while the change of the liquid phase channel 5 is just opposite. The width of the vapor phase channel increases from 600 μm to 1200 μm, and the hydraulic diameter of the corresponding channel increases from 300 μm to 342.9 μm; while the cross-sectional area of ​​the liquid phase channel 5 decreases linearly from the evaporator 2 to the condenser 3, and the channel width decreases from 700 μm To 300μm, the hydraulic diameter of the corresponding channel decreases from 311.1μm to 240μm. After the above adjustments, it is beneficial to enhance the spontaneous movement effect of the cooling working medium in the vapor p...

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Abstract

The invention discloses a micro cooling device of a silicon-substrate capillary pump loop and belongs to the temperature-control field of microelectronic chips. The micro cooling device of the silicon-substrate capillary pump loop is formed by bonding a pair of semi-conductor silicon wafers and a heat-resistant boron silicic acid glass piece. An evaporator, a condenser, a vapor phase channel, a liquid phase channel, a liquid storing cavity and a pumping or liquid filling channel are formed in the contact surface between the silicon wafers and the heat-resistant boron silicic acid glass piece in an etching mode. The evaporator and the condenser are connected through the vapor phase channel and the liquid phase channel to form a closed circuit. The evaporator comprises a micro conduit. The condenser comprises a condensing micro channel. A pumping or liquid filling hole is machined in the silicic acid glass piece. The liquid storing cavity is connected with the evaporator. The micro cooling device of the silicon-substrate silicon substrate loop can be directly integrated with a semi-conductor microelectronic chip so as to effectively reduce the temperature and the temperature gradient of the chip. The problems of hot spots caused by local high heat flow are reduced and relieved. Safe and reliable operation of the chip is ensured.

Description

technical field [0001] The invention relates to a high-efficiency micro-cooling device, in particular to a silicon-based capillary pump circuit micro-cooler, which belongs to the field of temperature control of microelectronic chips. Background technique [0002] With the rapid development of the semiconductor information and communication industry, the high integration and miniaturization of various related products and equipment has become an important development trend, which leads to a rapid increase in the heat load of microelectronic chips and the problem of excessive heat generation. Seriously affect the reliability of its work and even the entire system. At the same time, the uneven heating of the microelectronic chip itself will generate "hot spots" on the surface (the heating intensity can exceed 10 7 W / m 2 ), its existence is considered to be the key reason causing the chip "thermal runaway" and threatening system security. In view of the small cooling space an...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/367H01L23/42G06F1/20
Inventor 屈健王谦何志霞王颖泽
Owner JIANGSU UNIV
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