A preparation method of porous Cu surface for heat exchange

A technology of hydrothermal reaction kettle and substrate, which is applied in the direction of coating, metal material coating process, solid-state diffusion coating, etc., can solve the problems of serious equipment dependence, unevenness, small porous aperture, etc., and achieve excellent boiling heat transfer The effect of improving the boiling heat transfer coefficient and the effect of low equipment requirements

Active Publication Date: 2015-11-18
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as far as the preparation method is concerned, there are still the following deficiencies: (1) the sintering temperature required for sintering metal powder or wire mesh is very high (usually above 700°C), the energy consumption is large, and the preparation cost is high; (2) The flame spraying method is very effective for spraying on the outer surface of the metal substrate, but it is powerless for the inner surface of the tubular metal; (3) In addition to the existence of experimental conditions that need to be precisely controlled by the electroplating method, the prepared porous pores are small and uneven; ( 4) Machining or laser processing methods have defects such as complex processing technology and serious dependence on equipment

Method used

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  • A preparation method of porous Cu surface for heat exchange
  • A preparation method of porous Cu surface for heat exchange

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Experimental program
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Effect test

Embodiment 1

[0024] Step 1. Cut the dense Cu substrate into 50mm×5mm×1mm slices, place them in ethanol for ultrasonic degreasing, then place them in 1mol / L HCl solution for ultrasonic etching for 15 minutes, then wash them with deionized water and then naturally dry;

[0025] Step 2. Place the Cu substrate after natural air-drying in step 1 flatly on the polytetrafluoroethylene platform, and then place it together in a hydrothermal reaction kettle with a tetrafluoroethylene liner with a volume of 500mL. Add 20mL of absolute ethanol to the gap between the PTFE platforms, and finally seal the hydrothermal reactor and place it in an oven, and use steam to steam heat the Cu substrate for 6 hours at a temperature of 160°C to obtain Cu-based porous CuO film;

[0026] Step 3. Perform reduction heat treatment on the Cu-based porous CuO film described in step 2 in a hydrogen atmosphere with a volume purity of not less than 99.999%, to obtain a Cu-based porous Cu surface for heat exchange; the temp...

Embodiment 2

[0029] Step 1. Cut the dense Cu substrate into 20mm×10mm×0.1mm sheets, place them in ethanol for ultrasonic degreasing, then place them in 0.5mol / L HCl solution for ultrasonic etching for 30min, and then clean them with deionized water After natural air drying;

[0030] Step 2. Place the Cu substrate after natural air-drying in step 1 on a polytetrafluoroethylene platform, and then place it together in a hydrothermal reaction kettle with a tetrafluoroethylene liner with a volume of 800mL. Add 40mL of absolute ethanol to the gap between the PTFE platforms, and finally seal the hydrothermal reactor and place it in an oven, and steam heat the Cu substrate with steam for 8 hours at a temperature of 150°C to obtain Cu-based porous CuO film;

[0031] Step 3. Perform reduction heat treatment on the Cu-based porous CuO film described in step 2 in a hydrogen atmosphere with a volume purity of not less than 99.999%, to obtain a Cu-based porous Cu surface for heat exchange; the temperat...

Embodiment 3

[0034] Step 1. Cut the powder metallurgy sintered porous Cu substrate into a sheet of 60mm×25mm×0.1mm, place it in ethanol for ultrasonic degreasing, then place it in 1.5mol / L HCl solution for ultrasonic etching for 15min, and then use Naturally air-dry after washing with ionized water;

[0035] Step 2. Place the Cu substrate after natural air-drying in step 1 on a polytetrafluoroethylene platform, and then place it together in a hydrothermal reaction kettle with a tetrafluoroethylene liner with a volume of 800mL. Add 30mL of absolute ethanol to the gap between the PTFE platforms, and finally seal the hydrothermal reactor and place it in an oven, and steam heat-treat the Cu substrate with steam for 4 hours at a temperature of 180°C to obtain Cu-based porous CuO film;

[0036] Step 3. Perform reduction heat treatment on the Cu-based porous CuO film described in step 2 in a hydrogen atmosphere with a volume purity of not less than 99.999%, to obtain a Cu-based porous Cu surface...

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Abstract

The invention discloses a preparation method of a porous Cu surface for heat exchange. The method comprises the following steps: 1) placing a Cu substrate in ethanol for ultrasonic degreasing, then placing into an HCl solution for ultrasonic etching, further washing with deionized water and then naturally air-drying; 2) flatly placing the Cu substrate after natural air-drying on a polytetrafluoroethylene platform, placing into a hydrothermal reaction kettle with a tetrafluoroethylene inner liner, adding anhydrous ethanol into a gap between the hydrothermal reaction kettle and the polytetrafluoroethylene platform and performing steam heat treatment to get a Cu-based porous CuO thin film; and 3) performing reduction heat treatment on the Cu-based porous CuO thin film under a hydrogen atmosphere to get the Cu-based porous Cu surface for heat exchange. The Cu-based porous Cu surface prepared by the preparation method disclosed by the invention has an excellent boiling heat transfer effect; compared with a smooth base, the Cu-based porous Cu surface has the advantage that the boiling heat transfer coefficient at the initial stage of boiling can be increased by 8-12 times.

Description

technical field [0001] The invention belongs to the technical field of inorganic nanometer materials, in particular to a method for preparing a porous Cu surface for heat exchange. Background technique [0002] Enhanced boiling heat transfer is an effective means to reduce the heat transfer area and floor space of the boiling device, reduce huge engineering investment and improve the effective utilization of energy. Existing studies have confirmed that, compared with a smooth metal plate, the heat transfer coefficient can be greatly improved after constructing a porous surface on a metal substrate. Therefore, porous metal surfaces are a new class of heat transfer surfaces with broad application prospects. [0003] Cu and its alloys are indispensable and important materials in the field of boiling heat transfer due to their good thermal conductivity. The preparation methods for constructing porous surfaces on the surface of Cu substrates can be divided into two categories: ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F17/00C23F1/00C23C8/16C21D3/02
Inventor 李纲汤慧萍张文彦支浩迟煜頔李广忠王建忠康新婷李亚宁沈垒
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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