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Ultraviolet-curable high temperature resistant pressure-sensitive adhesive and preparation method thereof
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A pressure-sensitive adhesive, ultraviolet light technology, applied in the direction of adhesives, graft polymer adhesives, adhesive types, etc., can solve the problems of non-acrylate pressure-sensitive adhesive modification, etc., to achieve good high temperature shear performance Effect
Inactive Publication Date: 2014-01-01
TONSAN ADHESIVES INC
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The point is that the tape is thermally conductive and does not involve higher temperature resistance or bonding to low-surface-energy materials. The patent does not modify the acrylate pressure-sensitive adhesive
Method used
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preparation example Construction
[0042] The present invention relates to the preparation of a high temperature resistant pressure sensitive adhesive, the preparation process comprising:
[0043] (a) A solvent-free UV-curable prepolymer consisting of
[0044] ① Contains about 80-98% (by weight) of soft monomer and 2-20% (by weight) of hard monomer. ;
[0065] Add 0.15 parts of bis(multi)functional acrylate, 0.1~0.5 parts of photoinitiator to 100 parts of the above prepolymer, stir evenly and remove air bubbles, and apply it between two layers of transparent anti-adhesive films with a thickness of 1.0mm , and then placed in a 40W UV lamp for UV curing.
Embodiment 2
[0067] Add 5-15 parts of vinyl siloxane, 0.15 parts of (multi-) bifunctional acrylate, and 0.1-0.5 parts of photoinitiator to 100 parts of the above-mentioned prepolymer. After stirring evenly and removing air bubbles, spread it between two layers of transparent anti-adhesive films with a thickness of 1.0mm, and then put it into a 40W ultraviolet lamp for curing.
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Abstract
The invention relates to an ultraviolet-curable high temperature resistant pressure-sensitive adhesive. The ultraviolet-curable high temperature resistant pressure-sensitive adhesive comprises: a solvent-free ultraviolet-curable prepolymer comprising 80-98wt% of a soft monomer and 2-20wt% of a hard monomer; one or more functional monomers comprising monofunctional monomers, bifunctional monomers or multi-functional monomers; one or more organosilicone having reactive groups or acrylates grafted by the organosilicone having reactive groups; and photoinitiators comprising a free radical cracking type photoinitiator, a hydride abstraction type photoinitiator and an ion type photoinitiator. The whole preparation process of the pressure-sensitive adhesive does not use any volatile organic solvents and is environmentally-friendly; a pressure-sensitive adhesive tape using the pressure-sensitive adhesive has a good high temperature shear resistance, has a high peeling strength on low-surface-energy materials, has a one-piece structure, and can be processed to prepare thick products without inner liner base materials.
Description
technical field [0001] The invention relates to the preparation of pressure-sensitive adhesives and pressure-sensitive adhesive tapes, in particular to a pressure-sensitive adhesive that is environmentally friendly, solvent-free, UV-curable, has certain temperature resistance, and has good bonding strength to low surface energy materials and a method for preparing the pressure-sensitive adhesive tape. Background technique [0002] In recent years, the preparation of pressure-sensitive adhesives and pressure-sensitive tapes that are resistant to high temperatures and suitable for bonding low surface energy materials has mainly focused on solvent-based silicone pressure-sensitive adhesives and solvent-based acrylate pressure-sensitive adhesives, or solvent-based silicone modified adhesives. Research on permanent acrylatepressure sensitive adhesive. The production of these pressure-sensitive adhesives needs to use a large amount of organic solvents such as: toluene, ethyl ace...
Claims
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Application Information
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