Heat radiation paint for LED lamp and preparation method thereof

A technology for heat-dissipating paint and LED lamp, applied in the field of paint, can solve the problems of poor temperature resistance and aging resistance, poor heat dissipation effect, increase production cost, etc., and achieve the effects of good lubricity, strong adhesion and not easy to fall off

Inactive Publication Date: 2014-02-05
天长市天泰光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps
Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] A heat-dissipating coating for LED lamps, made of the following raw materials in parts by weight (kg): E-12 epoxy resin 32, silicone resin 13, tetraethylenepentamine 6, aluminum nitride powder 13, butyl acetate 22, n-butanol 5, triethanolamine 1, hexamethylenetetramine 1, vinyl tris(β-methoxyethoxy) silane 2, titanium dioxide 3, graphite powder 1, asbestos powder 4, o-xylene acid di Butyl ester 7, castor oil 1, film-forming aid 3;

[0011] The film-forming aid is prepared from the following raw materials in parts by weight (kg): nano jade powder 3, crosslinking agent TAC2, alcohol ester dodeca 4, silane coupling agent KH550 1, styrene 3, ricinoleic acid 1 , maleic anhydride 2, morpholine 2, tert-butyl peroxyvaleric acid 0.3, isophorone 1, xylene 4, ethyl acetate 12; the preparation method is: nano jade powder, morpholine, benzene Mix ethylene and ricinoleic acid, add to the mixed solvent of ethyl acetate and xylene, stir for 8 minutes, heat to 65°C, stir for 20 min...

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Abstract

A heat radiation paint for an LED lamp is prepared by the following raw material by weight: 30-35 parts of E-12 epoxy resin, 12-15 parts of organic silicone resion, 5-7 parts of tetraethylenepentamine, 10-14 parts of aluminium nitride powder, 20-25 parts of n-butyl acetate, 4-6 parts of n butanol, 1-2 parts of triethanolamine, 1-2 parts of hexamethylenetetramine, 2-3 parts of vinyl tri(beta-methoxy ethoxy)silane, 2-4 parts of titanium dioxide, 1-2 parts of graphite, 3-5 parts of asbestos powder, 6-8 parts of o-xylene acid dibutyl, 1-2 parts of castor oil, and 3-4 parts of film forming auxiliary agent. Aluminium nitride powder is added, so as that the paint has high heat conduction rate and good heat radiation effect, can be long-term used under 200 DEG C without change of mechanical property; titanium dioxide is added, so as that the paint can shield ultraviolet ray, and is beneficial to human body health; and graphite is added, so as that the paint has advantages of good lubricity and easy construction; and the paint also has advantages of large adhesion stress, not easy shedding, aging resistance and long service life.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, in particular to a heat dissipation coating for an LED lamp and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher thermal conductivity, but this will increase the produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D183/00C09D7/12C09D5/00
Inventor 徐家君缪晨生徐升亮
Owner 天长市天泰光电科技有限公司
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