Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive

A technology of epoxy resin glue and epoxy resin, which is applied in the directions of epoxy resin glue, novolak epoxy resin adhesive and adhesive, can solve the problems of long curing time at room temperature and obvious accumulation of objects to be treated, etc. To achieve the effect of shortening the initial curing time, meeting process requirements, and convenient construction

Active Publication Date: 2015-05-27
上海都昱新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although there are also such epoxy adhesives at present, in order to achieve high hardness and heat resistance, they need to be cured at high temperature or at room temperature for a long time. Although it is cured at room temperature, it takes 1 to 2 hours for initial curing, and more than 8 hours for complete curing, which also brings great inconvenience to the assembly line operation, and the accumulation of pending materials is obvious

Method used

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  • Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive
  • Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive
  • Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive

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preparation example Construction

[0024] The preparation method of the two-component epoxy resin glue that is used for silicon block or silicon rod splicing comprises the steps:

[0025] The preparation process of component A is as follows: put epoxy resin, phenolic modified epoxy resin, thixotropic agent, and filler into the reaction kettle, and stir in vacuum for 1.5 to 3 hours;

[0026] The preparation process of component B is as follows: Put the modified amine curing agent, polymer mercaptan, accelerator, thixotropic agent, and filler into the reaction kettle, and stir in vacuum for 1.5 to 3 hours.

Embodiment 1

[0028]

[0029]

[0030] Preparation of component A: Put epoxy resin, phenolic modified epoxy resin, gas phase SiO2, and silicon micropowder into the reaction kettle according to mass percentage, and stir in vacuum for 1.5 hours.

[0031]

[0032] Preparation of component B: Put phenolic modified fatty amine, polymeric mercaptan, 2,4,6-tris(dimethylaminomethyl), gas phase SiO2, and silicon micropowder into the reaction kettle according to mass percentage, and stir in vacuum for 1.5 hours.

Embodiment 2

[0034]

[0035] The preparation process of component A is as follows: Put epoxy resin, phenolic modified epoxy resin, bentonite, and silicon micropowder into the reaction kettle according to the mass percentage, and stir in vacuum for 3 hours.

[0036]

[0037] The preparation process of component B is as follows: put phenolic modified fatty amine, polymerized mercaptan, 2,4,6-tris(dimethylaminomethyl), gas phase SiO2, silicon micropowder into the reaction kettle according to the mass percentage, and vacuum stir for 3 Hour.

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Abstract

The invention discloses a dual-component epoxy resin adhesive for splicing a silicon block or a silicon rod and a preparation method of the dual-component epoxy resin adhesive. The dual-component epoxy resin adhesive for splicing the silicon block or the silicon rod consists of a component A and a component B in ratio of 1: 1, wherein the component A comprises the following materials by mass percent: 30 to 60% of epoxy resin, 10 to 30% of formaldehyde modified epoxy resin, 1 to 5% of thixotropic agent, and 20 to 50% of filling agent; and the component B comprises the following materials by mass percent: 20 to 50% of modified amine curing agent, 10 to 40% of polymeric mercaptan, 3 to 5% of accelerant, 1 to 5% of thixotropic agent, and 20 to 60% of filling agent. By adopting the preparation method, the primary curing time is decreased, and the process requirements are met.

Description

technical field [0001] The invention relates to a two-component epoxy resin glue and a preparation method thereof, in particular to a two-component epoxy resin glue used for splicing silicon blocks or silicon rods and a preparation method thereof. Background technique [0002] In recent years, with the rise of clean energy, the solar photovoltaic industry has also set off a boom. In just a few years, domestic solar silicon wafer cutting companies have increased from dozens to more than 300, thus increasing the demand for various auxiliary materials. Adhesive is also one of the indispensable auxiliary materials in the silicon wafer cutting process. Different processes require adhesives with different properties, and one of the adhesives requires vertical surface construction, high hardness and Only the high heat resistance can meet the requirements of the process. As crystalline silicon is growing, the amount of feed, the control of the crystal diameter, and the control of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/04C09J11/06
Inventor 许期斌张丽芳杨丽燕
Owner 上海都昱新材料科技有限公司
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