Preparation method of P-type crystal silicon double-sided cell
A double-sided battery, crystalline silicon technology, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as restricted application scope and high production costs, and achieve the effects of increasing power generation, improving utilization, and saving production costs
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Embodiment 1
[0026] A method for preparing a P-type crystalline silicon double-sided battery, the method comprising the following steps:
[0027] (a) P-type silicon substrate texturing:
[0028] Select a P-type silicon wafer with a resistivity of 0.3 ? Dilute about 10% hydrochloric acid and hydrofluoric acid for cleaning to remove surface impurities;
[0029] (b) Phosphorus is diffused on the front surface of the P-type silicon substrate to form a PN junction:
[0030] In a diffusion furnace at a temperature of 600°C, using POCl 3 Perform phosphorus diffusion to make the square resistance range 40-120? / □;
[0031] (c) Removal of phosphosilicate glass, back PN junction, and side PN junction:
[0032] In single-side etching equipment, use a mixed solution of 5% hydrofluoric acid and 50% nitric acid to etch the back surface and edge of the silicon wafer;
[0033] (d) Anti-reflection coating deposited on both sides:
[0034] On the front surface of the substrate, that is, on the PN junct...
Embodiment 2
[0040] A method for preparing a P-type crystalline silicon double-sided battery, the method comprising the following steps:
[0041] (a) P-type silicon substrate texturing:
[0042] Select a P-type silicon wafer with a resistivity of 5??cm, and use 1.0% potassium hydroxide solution to chemically etch the surface of the P-type single crystal silicon at 80°C to prepare a pyramid-shaped light-trapping structure texture, and then use Dilute about 10% hydrochloric acid and hydrofluoric acid for cleaning to remove surface impurities;
[0043] (b) Phosphorus is diffused on the front surface of the P-type silicon substrate to form a PN junction:
[0044] In a diffusion furnace at a temperature of 800°C, using POCl 3 Perform phosphorus diffusion to make the square resistance range 40-120? / □;
[0045] (c) Removal of phosphosilicate glass, back PN junction, and side PN junction:
[0046] In single-side etching equipment, use a mixed solution of 10% hydrofluoric acid and 60% nitric ac...
Embodiment 3
[0054] A method for preparing a P-type crystalline silicon double-sided battery, the method comprising the following steps:
[0055] (a) P-type silicon substrate texturing:
[0056] Select a P-type silicon wafer with a resistivity of 10??cm, and use 2.0% sodium hydroxide solution to chemically etch the surface of the P-type single crystal silicon at 85°C to prepare a pyramid-shaped light-trapping structure texture, and then use Dilute about 10% hydrochloric acid and hydrofluoric acid for cleaning to remove surface impurities;
[0057] (b) Phosphorus is diffused on the front surface of the P-type silicon substrate to form a PN junction:
[0058] In a diffusion furnace at a temperature of 900°C, using POCl 3 Perform phosphorus diffusion to make the square resistance range 40-120? / □;
[0059] (c) Removal of phosphosilicate glass, back PN junction, and side PN junction:
[0060] In single-side etching equipment, use a mixed solution of 15% hydrofluoric acid and 70% nitric acid...
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