Halogen-free epoxy resin composition and application thereof

Abstract

The invention discloses a halogen-free epoxy resin composition and application thereof. The epoxy resin composition comprises the following components: (A) halogen-free epoxy resin; (B) styrene-maleic anhydride copolymer (SMA) used as a first curing agent; (C) phosphorus-containing compound used as a second curing agent; and (D) cyanate or / and cyanate prepolymer. The high-frequency circuit substrate using the epoxy resin composition comprises one or more pieces of mutually superimposed prepreg and copper foils respectively coated on two sides, wherein the prepreg comprises a base material and the halogen-free epoxy resin composition which is attached to the base material by immersing and drying.

Description

technical field [0001] The invention relates to a halogen-free epoxy resin composition and its application, in particular to a halogen-free epoxy resin composition and resin glue, prepreg, laminate, copper-clad laminate and high frequency circuit board. Background technique [0002] Traditional copper-clad laminates for printed circuits mainly use brominated epoxy resin, and bromine is used to realize the flame-retardant function of the board. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. On July 1, 2006, the EU's two environmental protection directives "Regarding Waste Electrical and Electronic Equipment" and "Restricting the Use of Certain Hazardous Substances in Electrical and Electronic...

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Problems solved by technology

[0003] After several years of development, at present, there are two main technical approaches to realize the halogen-free flame retardant of copper-clad laminates. The first approach uses phosphorus-containing epoxy resin as the main resin, and then uses dicyandiamide or phenolic resin as the main resin. Curing agent, add a certain amount of inorganic fillers such as aluminum hydroxide, use dicyandiamide as the curing agent for phosphorus-containing epoxy resin, the board has poor heat resistance and high water absorption; use phenolic resin as the curing agent for phosphorus-containing epoxy resin , the appearance of the prepreg is poor, the brittleness of the plate is large, and the processability is poor

The second way is to use benzoxazine resin as the main resin, add an appropriate amount of phosphorus-containing epoxy resin or phosphorus-containing, nitrogen-containing curing agent, and then add an appropriate amount of organic or inorganic fillers. The benzoxazine resin has good Heat resistance and low water absorption, but high brittleness and poor processing performance of the plate

However, due to the inherent high moisture absorption of cyanate ester, when it is used in a large amount in the composition, the overall moisture and heat resistance performance is not stable, and when the amount of cyanate ester is small, the dielectric properties of the composition cannot be achieved. better improved

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