Method for manufacturing resin diamond line by non-plating diamond
A resin diamond wire and diamond technology, applied in the direction of manufacturing tools, stone processing equipment, fine working devices, etc., can solve the problems of harming the health of operators, complicated metal coating process, serious environmental pollution, etc. Conducive to long-term development and high cutting quality
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[0032] Example 1: Using the method of the present invention to produce resin diamond wire with non-coated diamond powder, the production process is as follows:
[0033] (1) Surface modification of diamond micropowder: Take single crystal diamond micropowder with a particle size range of 1-50μm, remove the non-diamond carbon layer on the surface with 30% nitric acid, and then use 10% water loss sorbus Surface modification treatment with alcohol monostearate;
[0034] (2) Prepare resin emery blend material: take 28wt% of resin binder, 25wt% of organic solvent, 30wt% of diamond powder after step (1) surface modification treatment, ultrafine SiC with a particle size range of 1-5μm The powder is 17wt%, the resin binder and the organic solvent are mixed and stirred. After the resin is dissolved, the above-mentioned diamond powder and SiC ultra-fine powder are added and mixed uniformly to form a paste to obtain a resin emery blend material; among them, resin The binder is phenolic resin,...
Example Embodiment
[0038] Example 2: The difference from Example 1 is that in step (1), a mixed acid with a concentration of 30% is used to remove the non-diamond carbon layer on the surface, and then a polyacrylic acid with a mass fraction of 10% and a mass fraction of 15 % Fatty alcohol polyoxyethylene ether has successively modified the surface of diamond powder; the mixed acid is a mixture of sulfuric acid and perchloric acid, wherein the ratio of sulfuric acid and perchloric acid is 3:1; in step (2) the resin emery The weight percentage of each component in the blended material is: 25wt% resin binder, 23wt% organic solvent, 30wt% diamond powder, 22wt% SiC ultrafine powder, and the resin binder is made of epoxy resin and acrylic resin. Mixture; the wire feeding speed in step (3) is 0.2m / s; in step (4), it is heated and cured at a temperature of 1000°C for 15 minutes; in step (5), the temperature is raised to 450°C in 25h, and then kept for 8h, Then naturally cool down to room temperature.
Example Embodiment
[0039] Example 3: The difference from Example 1 is that in step (1), sulfonic acid ester and sodium lauryl sulfonate are used to modify the surface of diamond powder successively; in step (2), the resin emery blend material The weight percentages of the components are: resin binder 17wt%, organic solvent 38wt%, diamond powder 20wt%, SiC ultrafine powder 25wt%; wherein the resin binder is epoxy resin; in step (3), send The linear velocity is 0.1m / s; in step (4), heat and solidify at a temperature of 400°C for 30 minutes; in step (5), the temperature is raised to 500°C within 40 hours, kept for 5 hours, and then naturally cooled to room temperature.
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