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Low-formaldehyde high-strength adhesive and preparation method thereof

A high-strength, adhesive technology, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of low bonding strength, excessive content, poor water resistance, etc., and achieve fast curing and high viscosity , good performance indicators

Inactive Publication Date: 2014-05-21
GUANGXI JISHUN ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the purpose of the present invention is to provide a low-formaldehyde high-strength adhesive and a preparation method thereof to solve the problems of existing adhesives such as low bonding strength, poor water resistance, and excessive formaldehyde content, and obtain a standard adhesive. mixture

Method used

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  • Low-formaldehyde high-strength adhesive and preparation method thereof

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Effect test

Embodiment 1

[0019] The technical scheme that present embodiment 1 adopts is:

[0020] A low-formaldehyde high-strength adhesive is characterized in that it is composed of the following raw materials by weight percentage: deionized water 65%, formaldehyde 4.5%, urea 10%, polyvinyl alcohol 10%, wheat flour 7%, acetic acid 0.2% , Sodium Hydroxide 0.25%, Curing Agent 0.1%, Tannin 0.05%.

[0021] A method for preparing a low-formaldehyde high-strength adhesive, comprising the following steps:

[0022] a) Add deionized water into the reaction pot according to the ratio, add polyvinyl alcohol when the temperature rises to 60°C, and then heat up to 85°C to completely dissolve the polyvinyl alcohol, add wheat flour and stir evenly after the dissolution is complete;

[0023] b) After the solution is cooled to 70°C, add acetic acid dropwise and stir for 20 minutes, then add formaldehyde for condensation reaction; when the temperature is lowered to 60°C, add sodium hydroxide to adjust the pH val...

Embodiment 2

[0026] The technical scheme that present embodiment 2 adopts is:

[0027] A low-formaldehyde high-strength adhesive, composed of the following raw materials by weight percentage: 75% deionized water, 3.8% formaldehyde, 5% urea, 10% polyvinyl alcohol, 5% wheat flour, 0.2% acetic acid, hydrogenated Sodium 0.12%, curing agent 0.1%, tannin 0.05%.

[0028] A method for preparing a low-formaldehyde high-strength adhesive, comprising the following steps:

[0029] a) Add deionized water into the reaction pot according to the ratio, add polyvinyl alcohol when the temperature rises to 65°C, and then heat up to 85°C to completely dissolve the polyvinyl alcohol, add wheat flour and stir evenly after the dissolution is complete;

[0030] b) After the solution is cooled to 70°C, add acetic acid dropwise and stir for 20 minutes, then add formaldehyde for condensation reaction; when the temperature is lowered to 65°C, add sodium hydroxide to adjust the pH value to 8.0;

[0031] c) Add u...

Embodiment 3

[0033] The technical scheme that present embodiment 3 adopts is:

[0034] A low-formaldehyde high-strength adhesive, which is composed of the following raw materials by weight percentage: 70% deionized water, 4.0% formaldehyde, 5% urea, 15% polyvinyl alcohol, 5% biomass, 0.15% acetic acid, hydrogen Sodium oxide 0.2%, curing agent 0.08%, tannin 0.03%.

[0035] A method for preparing a low-formaldehyde high-strength adhesive, comprising the following steps:

[0036] a) Add deionized water into the reaction pot according to the ratio, add polyvinyl alcohol when the temperature rises to 60°C, and then heat up to 85°C to completely dissolve the polyvinyl alcohol, add biomass after the dissolution is complete, and stir evenly;

[0037] b) After the solution is cooled to 75°C, add acetic acid dropwise and stir for 20 minutes, then add formaldehyde for condensation reaction; add sodium hydroxide to adjust the pH value to 7.0 when the temperature is lowered to 60°C;

[0038] c) A...

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Abstract

The invention discloses a low-formaldehyde high-strength adhesive and a preparation method thereof. The adhesive comprises the following raw materials: deionized water, formaldehyde, urea, polyvinyl alcohol, biomass, acetic acid, sodium hydroxide, a curing agent and tannin. The preparation method comprises the following steps: adding the deionized water and the polyvinyl alcohol to a reaction pot according to the ratio; heating to completely dissolve the polyvinyl alcohol; adding the biomass and evenly agitating after completely dissolving; dropwise adding the acetic acid to agitate after the solution is cooled; adding the formaldehyde to carry out condensation reaction; dripping the sodium hydroxide to adjust the pH value to neutral property after cooling; adding the urea to carry out amination treatment; adding the tannin and the curing agent to evenly agitate; dropwise adding the sodium hydroxide to adjust the pH value after sampling and checking out; and cooling, filtering and discharging, bulking by a barrel, so as to obtain the low-formaldehyde high-strength adhesive. An adhesive prepared by adopting a traditional technical formula is high in free formaldehyde content in general, and generates a great harm to a human body. The adhesive disclosed by the invention has the advantages of low free formaldehyde, high bonding strength, rapid curing, low cost and the like according with the standards.

Description

technical field [0001] The invention relates to the field of an adhesive for bonding wood and a manufacturing process, in particular to a low-formaldehyde high-strength adhesive and a preparation method thereof. Background technique [0002] Adhesives are mainly used in wood-based panels and building materials industries. In recent years, more and more attention has been paid to the harm of formaldehyde. Formaldehyde is a colorless and soluble irritating gas, which has great harm to the human body. Wood products made of formaldehyde-containing adhesives are used indoors, and the release period of formaldehyde can be as long as 15 years. Studies have shown that long-term exposure to low-dose formaldehyde can cause chronic respiratory diseases, nasopharyngeal cancer, colon cancer, brain tumors, menstrual disorders, gene mutations in the nucleus, DNA single-strand cross-linking and DNA-protein cross-linking and inhibition of DNA damage. Repair, pregnancy syndrome, cause chrom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J129/14C09J11/06C08F8/28C08F8/30
Inventor 蒙献芳周子茜马庆
Owner GUANGXI JISHUN ENERGY TECH
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