Unlock instant, AI-driven research and patent intelligence for your innovation.

Rapid bonding method for micro-fluidic chip

A microfluidic chip and bonding technology, applied in the field of micromachining, can solve the problem of low bonding efficiency

Inactive Publication Date: 2014-05-28
HANGZHOU TINKER BIOTECHNOLOGY CO LTD
View PDF12 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing paste bonding relies on manual alignment and pasting, and the bonding process also requires some auxiliary tools such as air bubble removal and pressurization devices, which has the disadvantage of low bonding efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rapid bonding method for micro-fluidic chip
  • Rapid bonding method for micro-fluidic chip
  • Rapid bonding method for micro-fluidic chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] figure 1 It is a schematic diagram of a microfluidic chip bonding process based on double-sided adhesive and ball hook structure. The specific process is as follows: (1) Align the ball hook structure D on the two substrates A and C, and the pressure-sensitive double-sided adhesive B is located in the middle of the two substrates; (2) Align the ball hook structure D on the upper substrate A The hooks are pressed together with the complementary structure of the hooks on the lower substrate to form a whole, thereby preparing a closed microchannel E and completing the bonding of the microfluidic chip. The best bonding strength can be obtained by keeping the chip at room temperature in the dark for 3-10 hours. The method of this embodiment is particularly suitable for the bonding preparation of large-scale microfluidic chips.

Embodiment 2

[0025] Example 2 A microfluidic chip bonding method based on photoresist and ring-shaped hook structure

[0026] figure 2 It is a schematic diagram of the bonding process of a microfluidic chip based on a photoresist and a ring-shaped hook structure. The specific process is as follows: (1) Align the ring-shaped hook structures D' on the two substrates A' and C', wherein the photoresist film B' is coated on the surface of the lower substrate by a spin coating process; (2 ) Compress the ring-shaped hooks on the upper substrate A' with the complementary structure of the hooks on the lower substrate to form an integrated body, thereby preparing a closed microchannel E' and completing the bonding of the microfluidic chip. The chip is irradiated with ultraviolet light for a certain period of time to realize the curing and polymerization of the photoresist and obtain the best bonding strength.

Embodiment 3

[0027] Example 3 A microfluidic chip bonding method based on double-sided adhesive and an external cantilever hook module

[0028] image 3 It is a schematic diagram of a microfluidic chip bonding process based on double-sided adhesive and ball hook structure. The specific process is as follows: (1) align the two substrates a, c and the double-sided adhesive film b according to the hook insertion hole d, and the double-sided adhesive film is located in the middle of the two substrates; (2) use the double-sided adhesive film b Paste the graphics to paste the two substrates together to form a closed microfluidic channel e; (3) insert the cantilever hook module f into the two substrates through the hook insertion hole d to complete the bonding of the microfluidic chip. The best bonding strength can be obtained by keeping the chip at room temperature in the dark for 3-10 hours.

[0029] Using the fast bonding method of the microfluidic chip provided by the present invention, it ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a rapid bonding method for a micro-fluidic chip. The bonding of the chip is realized through pasting media together with a card hook structure between two substrates. The bonding process is only as follows: the two substrates are pasted through the pasting media such as a double faced adhesive tape, and a certain pressure is exerted by the card hook structure on the chip, so that the bonding of the micro-fluidic chip can be realized simply, rapidly and efficiently. According to the invention, the bonding method of the micro-fluidic chip doesn't need to use auxiliary accessories such as pressurized equipment and equipment, so the rapid bonding method is very suitable for the rapid manufacture and production of mass micro-fluidic chips.

Description

technical field [0001] The invention relates to the field of micromachining, in particular to a fast bonding method for a microfluidic chip. Background technique [0002] Microfluidic chip is a kind of miniature reaction or analysis system characterized by microchannel network. Due to the advantages of fast analysis speed, low reagent consumption, low cost of use, easy integration and automation, microfluidic chips have been widely used in research in the fields of chemistry, biology, and medicine. [0003] Materials used to make microfluidic chips include silicon, glass, quartz and other inorganic substances, metals and metal oxides, as well as polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), polycarbonate (PC) and other polymers. Different materials have different processing methods. Generally speaking, the processing of microfluidic chips mainly includes the processing of microstructures (such as microchannels, microchambers, microwells, micromixers, etc.) ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 叶嘉明苑宝龙黄昱俊
Owner HANGZHOU TINKER BIOTECHNOLOGY CO LTD