Thermosetting resin composition of integrated circuit, prepreg and laminate
A resin composition and integrated circuit technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems that cannot meet the requirements of low dielectric constant, high water absorption rate, high dielectric constant, and moisture and heat resistance of plates. Reduction and other problems, to achieve the effect of reducing dielectric constant, low dielectric constant, and reducing thermal expansion coefficient
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Synthetic example 1
[0053] Preparation 1 of phosphorus-containing active ester compound:
[0054] Weigh 0.6mol of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and 0.6mol of p-hydroxybenzaldehyde, add 65% mass Concentration of H 2 SO 4 , condensed and refluxed at 100°C for 3 to 5 hours, and then the mixture was washed with alcohol 4 to 6 times to obtain the pre-product; the above-mentioned pre-product was dissolved in toluene solution, and 0.2mol of benzoic acid was added. temperature conditions, add 0.05mol catalyst (AlCl 3 ), condensed and refluxed for 4 hours, and then after several times of washing, dried for 4 hours under vacuum at 105°C to obtain the desired phosphorus-containing active ester compound with an esterification rate of 70-80% and a phosphorus content of 6.4%. Phosphorus-containing active ester compound, denoted as D1, the specific structure is as follows:
[0055]
[0056] X= , Y=H, Z= , R is phenyl, R1=CH 3 , n is 3~5.
[0057] The NMR...
Synthetic example 2
[0062] Synthesis Example 2: Synthesis of Allyl Modified Bismaleimide Prepolymer
[0063] React 100 parts of 4,4'-diphenylmethane bismaleimide resin with 50 parts of diallyl bisphenol A compound at 135°C for 80 minutes, then cool to room temperature to obtain the desired olefin Propyl modified bismaleimide resin prepolymer A1, its molecular weight is 2000~4000g / mol;
[0064] React 100 parts of 4,4'-diphenyl ether bismaleimide resin with 100 parts of diallyl bisphenol A allyl compound at 155°C for 50 minutes, then cool to room temperature to obtain the obtained The desired allyl-modified bismaleimide resin prepolymer A2 has a molecular weight of 4000-6000 g / mol.
Embodiment
[0066] Add allyl-modified bismaleimide prepolymer, acid anhydride compound, epoxy resin, phosphorus-containing active ester compound, curing accelerator, inorganic filler and solvent into the mixing tank according to the weight ratio shown in Table 1 , control the solid content of the glue solution to be 65%, stir evenly, and ripen for 8hr to make a resin composition glue solution; then impregnate the glass cloth in the above resin composition glue solution; then pass the impregnated glass cloth through 155~175 Baking at ℃ for 4~7 minutes to form a prepreg; cut the prepreg to a certain size and stack 8 prepregs to form a stack, place an electrolytic copper foil on the top and bottom of the stack, and send it into a vacuum press Pressing, the program is 150°C / 60min+200°C / 120min, to make a laminate.
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