Lead-free solder paste

A lead-free solder paste and lead-free tin powder technology, applied in welding media, welding/cutting media/materials, metal processing equipment, etc., can solve the problems of few types of lead-free solder paste, poor welding performance, and easy drying.

Inactive Publication Date: 2014-09-10
谢光玉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the problems existing in the aforementioned background technology, such as: the types of lead-free solder paste are few, easy to dry, poor solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] The invention provides a lead-free solder paste, including tin-based alloy solder powder and tin oil, the tin-based alloy solder powder includes tin, silver and copper, characterized in that: the lead-free tin powder is 91% by weight Tin (Sn), 3% bismuth (Cu) and 6% silver (Ag) composition, tin oil includes active agent, rosin resin, solvent and thixotropic agent, and this component is by weight 40% active agent, 50% rosin resin, 5% solvent, 2% thixotropic agent and the balance of additives. The active agent is a compound active agent formed by methylsuccinic acid, organic acid, and halogen salts; the solvent is composed of terpineol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether, Ethylene glycol monocaprylyl ether, diethylene glycol monohexyl ether, dipropylene glycol methyl ether, dipropylene glycol butyl ether, tetraglyme, 2-butyl-1-octanol, 2-ethyl-1.3-hexane One or more compositions in diol; the described t...

Embodiment 2

[0010] The lead-free tin powder is composed of 95% tin (Sn), 2% bismuth (Cu) and 3% silver (Ag) by weight, and the tin oil includes active agent, rosin resin, solvent and thixotropic agent, The component is composed of 25% of active agent, 50% of rosin resin, 15% of solvent, 1% of thixotropic agent and the rest of additives by weight. The active agent is a compound active agent formed by methylsuccinic acid, organic acid, and halogen salts; the solvent is composed of terpineol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether, Ethylene glycol monocaprylyl ether, diethylene glycol monohexyl ether, dipropylene glycol methyl ether, dipropylene glycol butyl ether, tetraglyme, 2-butyl-1-octanol, 2-ethyl-1.3-hexane One or more compositions in diol; the described thixotropic agent is one or two compositions in polyamide, hydrogenated castor oil; One or more of disproportionated rosin, esterified rosin, dimerized rosin, and rosin...

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PUM

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Abstract

The invention relates to lead-free solder paste which is composed of lead-free solder powder and solder oil. The lead-free solder powder is stannum bismuth copper alloy powder comprising stannum, argentum and copper. The lead-free solder paste is characterized in that the lead-free solder powder comprises, by weight, 91-99% of stannum (Sn), 0.5-3% of bismuth (Cu) and 0.5-6% of argentum (Ag), and the solder oil comprises, by weight, 25-40% of activator, 50-70% of rosin resin, 5-15% of solvent, 0.5-2.0% of thixotropic agent and the balance additives. The lead-free solder paste is good in solderability and low in corrosivity and has an environmental protection function.

Description

technical field [0001] The invention relates to a solder paste, in particular to a lead-free solder paste used in the soldering of electronic products. Background technique [0002] The electronic industry has used tin-lead solder for more than 50 years. In recent years, in order to reduce the impact of lead on the environment and human health, countries around the world have successively developed various lead-free solders, such as tin-silver series, tin-copper series, Lead-free solders such as tin-bismuth and tin-zinc. At present, the mainstream lead-free solder paste is tin-silver-copper lead-free solder paste. The mainstream lead-free alloy of tin-silver-copper system is Sn96.5%Ag3%Cu0.5, with a melting point of 217-219°C, which is much higher than that of tin-lead (Sn63 / Pb37) alloy has a melting point of 183°C, and its peak reflow temperature is above 235°C, much higher than the peak reflow temperature of tin-lead (Sn63 / Pb37) solder paste (210-230°C). At present, all...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/262B23K35/025B23K35/3613
Inventor 谢光玉
Owner 谢光玉
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