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Near-infrared sensing chip, preparation method and application thereof

A sensor chip and near-infrared light technology, applied in the field of photoelectric sensors, can solve the problems of unfavorable popularization and development of near-infrared light sensors, inability to face the society and the public, and not easy to operate, so as to reduce the size and cost, and achieve a simple structure. , the effect of convenient operation

Inactive Publication Date: 2014-09-10
RENMIN UNIVERSITY OF CHINA
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  • Abstract
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Problems solved by technology

Traditional near-infrared light sensor chips use highly toxic inorganic materials as sensing elements, such as cadmium sulfide, cadmium selenide, lead sulfide, etc. In addition, traditional near-infrared light sensor chips are huge in size and expensive. Expensive, difficult to degrade in the environment, not easy to carry, and not easy to operate. These shortcomings make the application of near-infrared light sensors limited to some universities, scientific research units and military institutions, etc., and cannot be oriented to the society and the public. It is not conducive to the application of near-infrared light sensors Further popularization and development of sensors

Method used

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  • Near-infrared sensing chip, preparation method and application thereof
  • Near-infrared sensing chip, preparation method and application thereof
  • Near-infrared sensing chip, preparation method and application thereof

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preparation example Construction

[0040] The preparation method of polypyrrole nanoparticles in the following examples: preparation 10mL mass fraction is 0.5% polyvinyl alcohol (molecular weight is 22000) aqueous solution as water phase, 0.4mL pyrrole and 2mL methylene chloride are mixed as oil phase, the two mixed Afterwards, disperse at a speed of 10,000 rpm for 3 minutes under a high-speed disperser, and then add 0.4 mL of saturated ferric chloride solution and stir at a speed of 300 rpm for 12 hours.

[0041] After-treatment to remove the surfactant polyvinyl alcohol (molecular weight: 22000) in the solution, specific steps: add 10 mL of deionized water to the above solution, centrifuge for 20 min at a speed of 10000 rpm in a high-speed centrifuge, and then remove the upper Clear liquid, then add 10mL deionized water to shake, centrifuge, this process is repeated 3 times. The obtained solution is lyophilized in a lyophilizer to obtain polypyrrole nanoparticles for future use.

[0042] The scanning electro...

Embodiment 1

[0044] Embodiment 1, preparation of near-infrared sensor chip and response to near-infrared light

[0045] (1) Preparation of near-infrared sensor chip

[0046] Precursor and cross-linking agent (model: Sylgard184, two-component reagent, respectively precursor and cross-linking agent; manufacturer: Dow Corning Corporation of the United States) are prepared by a mold to form a PDMS substrate with a mass ratio of 10:1 and a thickness of 2 mm. Then use punches of different diameters, respectively 15mm and 7.5mm, to punch holes in the PDMS substrate based on the same center of circle, to obtain a PDMS annular substrate with through holes, as shown in figure 1 Shown in the middle left figure.

[0047] The upper and lower surfaces of the PDMS ring substrate and the two coverslips were subjected to Plasma treatment (PR-4 glue remover, power: 330W, gas used: air) for two minutes, and then the PDMS substrate and the coverslip were bonded. The bonding process requires heating at 65°C fo...

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Abstract

The invention discloses a near-infrared light sensing chip based on ion liquid-polypyrrole nano-particles, a preparation method and an application thereof. The near-infrared sensing chip comprises a polydimethylsiloxane substrate, 2 pieces of cover glasses and 2 electrodes; one piece of cover glass attaches to the upper surface of the polydimethylsiloxane substrate while the other attaches to the lower surface of the polydimethylsiloxane substrate, and the two pieces of cover glasses are in seal fit with the upper surface and the lower surface; a through hole is formed in the polydimethylsiloxane substrate and filled with the mixture of polypyrrole nano-particles and ion liquid; the two electrodes pass through the polydimethylsiloxane substrate to contact with the mixture. Compared with a traditional near-infrared sensing chip, the near-infrared sensing chip enables the chip volume and cost to be lowered, is simple in structure, is convenient to operate and has low detection limit to the near infrared.

Description

technical field [0001] The invention relates to a near-infrared sensor chip and its preparation method and application, in particular to a near-infrared sensor chip based on ionic liquid-polypyrrole nanoparticles, its preparation method and application, and belongs to the field of photoelectric sensors. Background technique [0002] The near-infrared light sensor is a sensor that can detect the intensity of near-infrared light at a specific wavelength. The near-infrared light sensor can be divided into two types according to its sensing mechanism, one is a photon sensor, based on the mechanism of the photoelectric effect; the other is Thermal sensor, based on the thermal effect mechanism of light-to-heat conversion. Traditional near-infrared light sensor chips use highly toxic inorganic materials as sensing elements, such as cadmium sulfide, cadmium selenide, lead sulfide, etc. In addition, traditional near-infrared light sensor chips are huge in size and expensive. Expensi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/28B82Y15/00
Inventor 王亚培贾晗钰贺泳霖
Owner RENMIN UNIVERSITY OF CHINA
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