A kind of silver paste for printed circuit board with low silver content and preparation method thereof

Abstract

A silver paste for printed circuit boards with low silver content, made of the following raw materials in parts by weight: 1-2 glucose, 20-30 nano-scale flake copper powder, 30-40 1-20 μm flake silver powder, and 13-40 glass powder 16. Hyperbranched polyester resin 5‑7, terpineol 5‑8, thiodiethylene glycol 2‑5, bisphenol A epoxy resin 2‑4, butyl carbitol 6‑8, ethyl acetate 7 ‑9, nano-titanium dioxide 1-2, nano-crystalline cellulose 1-2, nano-tantalum carbide powder 3-5, nano-niobium carbide powder 3-5; the silver paste of the present invention adds nano-scale flake copper powder and nano-tantalum carbide Powder and nanometer niobium carbide powder not only maintain good electrical conductivity, but also save the amount of silver powder; the glass powder of the present invention is lead-free and environmentally friendly, has good adhesion and firm circuit; Good performance makes the circuit yield high.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a silver paste for a printed circuit board with low silver content and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass pow...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance