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Hot-dip fluxing agent for copper wire for electronic component lead wires and preparation method thereof

A technology of electronic components and hot-dip plating, applied in hot-dip plating process, coating, metal material coating process, etc., can solve problems such as copper corrosion, improve welding performance, reduce resistance, and improve hot-dip tin plating Effect

Inactive Publication Date: 2014-10-08
NINGGUO XINBONENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because ordinary copper wires are exposed to the air and contain a lot of oxygen molecules in the air, the reaction between copper and oxygen molecules can easily lead to copper corrosion in a short time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A copper wire hot-dipping flux for electronic component leads, characterized in that it comprises the following raw materials in weight percent: 5.5% ammonium chloride, 10.8% zinc chloride, 10% modified resin, 12% surfactant, 9% polyurethane, 0.56% hydrochloric acid, 5% formic acid, and the balance is deionized water.

[0018] The preparation method of the copper wire hot-dipping flux for the lead wire of the electronic component is as follows, comprising the following sequential steps:

[0019] (1) Add ammonium chloride and zinc chloride to deionized water according to the above weight percentage, and stir until they are completely dissolved;

[0020] (2) Add modified resin and surfactant to the solution obtained in step (1) according to the above weight percentage, and stir until completely dissolved;

[0021] (3) Add polyurethane and formic acid to the solution obtained in step (2) according to the above weight percentage, and stir fully until completely dissolved; ...

Embodiment 2

[0024] A copper wire hot-dipping flux for lead wires of electronic components is characterized in that it comprises the following raw materials in weight percent: 1.5% ammonium chloride, 5.0% zinc chloride, 1% modified resin, 5% surfactant, 1% polyurethane, 0.05% hydrochloric acid, 1% formic acid, and the balance is deionized water.

[0025] The preparation method of the copper wire hot-dipping flux for the lead wire of the electronic component is as follows, comprising the following sequential steps:

[0026] (1) Add ammonium chloride and zinc chloride to deionized water according to the above weight percentage, and stir until they are completely dissolved;

[0027] (2) Add modified resin and surfactant to the solution obtained in step (1) according to the above weight percentage, and stir until completely dissolved;

[0028] (3) Add polyurethane and formic acid to the solution obtained in step (2) according to the above weight percentage, and stir fully until completely dis...

Embodiment 3

[0031] A copper wire hot-dipping flux for lead wires of electronic components is characterized in that it comprises the following raw materials in weight percent: 2.8% ammonium chloride, 7.5% zinc chloride, 7% modified resin, 8% surfactant, Polyurethane 7%, hydrochloric acid 0.32%, formic acid 2%, the balance is deionized water.

[0032] The preparation method of the copper wire hot-dipping flux for the lead wire of the electronic component is as follows, comprising the following sequential steps:

[0033] (1) Add ammonium chloride and zinc chloride to deionized water according to the above weight percentage, and stir until they are completely dissolved;

[0034] (2) Add modified resin and surfactant to the solution obtained in step (1) according to the above weight percentage, and stir until completely dissolved;

[0035] (3) Add polyurethane and formic acid to the solution obtained in step (2) according to the above weight percentage, and stir fully until completely dissolv...

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PUM

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Abstract

The invention relates to the technical field of processing of copper wires, and discloses a hot-dip fluxing agent for a copper wire for electronic component lead wires and a preparation method thereof. The fluxing agent comprises the following raw materials in percent by weight: 1.5-5.5% of ammonium chloride, 5.0-10.8% of zinc chloride, 1-10% of modified resin, 5-12% of a surfactant, 1-9% of polyurethane, 0.05-0.56% of hydrochloric acid, 1-5% of formic acid and the balance deionized water. The fluxing agent is good in performances and stable. The surfactant helps to reduce the surface tension of a tin solution for tinning, and thus the resistance is reduced and the activity is improved. The fluxing agent is capable of effectively removing oxides on the surface of a copper wire to enable the surface of the copper wire to reach the cleanliness needed by hot dip, and also preventing the copper wire surface from being oxidized again and improving the weldability for hot dip. The processed copper wire can be well subjected to hot-dip tinning.

Description

technical field [0001] The invention relates to the technical field of copper wire processing, in particular to a copper wire hot-dipping flux for lead wires of electronic components and a preparation method thereof. Background technique [0002] Foreign countries have made in-depth research on the leads of electronic components. In recent years, a lot of work has been done in China, and remarkable achievements have been made. At the end of 1982, the Ministry of Electronics Industry formulated the departmental standards for tinned copper wire and tinned steel clad steel wire. During the production and use of components, the leads are subjected to moisture, heat, bending and stretching. Therefore, the material must have good heat resistance, corrosion resistance and certain mechanical properties. In the production of wire rods, it is necessary to prevent copper wires from being corroded by chlorine, ammonia, sulfur dioxide, etc. in the atmosphere; the surface must be kept ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C2/06C23C2/38
Inventor 罗宏强
Owner NINGGUO XINBONENG ELECTRONICS
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