Technology for preparing multilayer mixed nanometer strengthening layer with metal surface deposited with iron, vanadium, titanium and titanium nitride

A preparation process and metal surface technology, which is applied in the direction of metal material coating process, coating, ion implantation plating, etc., can solve the problems of film hardness and surface quality reduction, poor bonding force, poor substrate bonding force, etc.

Active Publication Date: 2014-11-12
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

However, the general coating is relatively thin, and if it is too thick, it will have a large internal stress with the substrate, showing poor bonding with the substrate and easy to peel off; arc ion plating technology has the characteristics of h

Method used

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Embodiment Construction

[0021] The present invention will be further illustrated below by specific examples

[0022] The quenched T10 steel is used as a sample, and ultrasonic cleaning is carried out in a mixture of alcohol and acetone for more than half an hour.

[0023] Dry the cleaned sample, hang it on the fixture, and place it on the turntable of the vacuum chamber, and the workpiece frame rotates while revolving. After installing the sample, wipe the sealing ring with absolute alcohol to ensure that there are no impurities on it, and close the chamber door.

[0024] Turn on the vacuum system and pump to 8×10 -4 Turn on the heating system at Pa, heat to 200°C, and then evacuate to Pa; pass argon gas to 5 Pa, and clean the sample with -700V bias for 15 minutes; after cleaning, turn off the bias, evacuate to Pa, and keep the test The sample temperature is 200°C, the argon gas is introduced and the working pressure is adjusted to 0.5Pa, and the pure iron target power supply is turned on. Here, th...

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Abstract

The invention discloses a technology for preparing a multilayer mixed nanometer strengthening layer with the metal surface deposited with iron, vanadium, titanium and titanium nitride. A magnetron sputtering technology is utilized, and a nano-scale-thickness iron + iron - vanadium + vanadium + vanadium - titanium + titanium + titanium - titanium nitride mixed transition layer is deposited on the surface of an iron-based material in sequence; a nanoscale titanium nitride strengthening layer is compounded to the transition layer to form the multilayer mixed transitional compound strengthening layer with good binding force. By the utilization of the solid solubility conception of various metal atoms, alloy elements which are soluble mutually and infinitely and high in strength are found as the transition layer, the mixed nanometer transition layer is deposited on the surface of a substrate made of metal materials through magnetron sputtering, and titanium nitride is deposited finally, so that the multilayer mixed nanometer strengthening layer is formed. The formed transition layers are distributed in a smooth and gradient mode, residual internal stress is small, the film and substrate bonding strength is largely enhanced, the bonding force between the layers and the substrate is enhanced, and the characteristics of corrosion resistance, abrasion resistance and high hardness of the titanium nitride metal ceramic film on the surface can be fully represented.

Description

technical field [0001] The invention relates to surface engineering technology, in particular to a preparation process for depositing iron+vanadium+titanium+titanium nitride multilayer mixed nano-reinforced layer on the metal surface. Background technique [0002] Titanium nitride is a cermet, which belongs to the hard film coating. It can effectively improve the surface hardness, wear resistance and corrosion resistance of materials, and greatly improve the service life of parts. Therefore, it is widely used in machinery manufacturing, automobile industry, and textile industry. , geological drilling, mold industry, aerospace and other fields. At present, the main preparation techniques of titanium nitride thin films are magnetron sputtering, arc ion plating, etc. The magnetron sputtering preparation technology deposits fine particles, good film compactness and excellent surface quality. However, the general coating is relatively thin, and if it is too thick, it will have a...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/16C23C14/06
Inventor 高原王成磊韦文竹陆小会张光耀
Owner GUILIN UNIV OF ELECTRONIC TECH
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