Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method

A technology of high thermal conductivity graphite and thermal fiber, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of poor strength and mechanical properties of pure thermal conductive graphite sheet, difficulty in meeting the use requirements, graphite dust falling off, etc., so as to facilitate subsequent processing and use , light weight, enhanced strength effect

Active Publication Date: 2014-11-12
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional graphite heat sink processing method only uses a single graphite powder, or uses carbon black, boron nitride, copper powder, etc. to be filled with graphite particles. It is easy to cause graphite dust to fall off under heavy work, and the strength is small, the mechanical properties are poor, and it is difficult to meet the use requirements
The strength and mechanical properties of pure thermally conductive graphite sheets are far inferior to metals, which brings difficulties to subsequent processing
At the same time, due to the disadvantage of graphite being fragile, it will cause problems such as complicated operation and easy damage during use.

Method used

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  • Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Select natural flake graphite powder and graphite fiber with a carbon element content of 99.5% and a particle size of 180 μm, and the mass ratio of graphite powder to graphite fiber is 100:1. The natural flake graphite powder is put into the acid treatment solution for chemical treatment and impurity treatment, and the treated flake graphite powder is washed with water and dried. Mix the treated flake graphite powder according to the ratio of flake graphite powder: graphite fiber = 1000: 1 parts by mass, then put it into a graphite expansion furnace for high temperature expansion, and then make it through graphite coil production equipment with a density of 1.5g / cm3, graphite heat sink with high strength and high thermal conductivity with a thickness of 0.1mm. Such as figure 1 as shown, figure 1 It is a structural schematic diagram of the heat-conducting fiber-reinforced heat sink with high thermal conductivity of the present invention. Wherein, 53 is graphite fiber...

Embodiment 2

[0026] The preparation method is carried out as follows:

[0027] Step 1, first put the flake graphite powder into a mixture of sulfuric acid solution and hydrogen peroxide for treatment, wherein sulfuric acid solution: hydrogen peroxide = 1:3 parts by weight, the treatment time is 2h, the treatment temperature is 20°C, and then washed in water at 30°C until the pH of the washing solution is 5, and then dry the graphite powder after water washing in a drying oven at 150°C for 2 hours.

[0028] Step 2. Mechanically disperse and mix the dried flake graphite powder in a high-mixing disperser according to the ratio of flake graphite powder: graphite fiber = 2:1 parts by mass. The dispersion time is 30 minutes, and then put it into a graphite expansion furnace Perform high-temperature expansion at 800°C, and the high-temperature expansion time is 20s, and then make a heat-conducting fiber-reinforced high-thermal-conduction graphite heat sink through a graphite coil double-roller eq...

Embodiment 3

[0030] The preparation method is carried out as follows:

[0031] Step 1, first put the flake graphite powder into the mixed solution of sulfuric acid solution and hydrogen peroxide for treatment, wherein sulfuric acid solution: hydrogen peroxide = 1:20 parts by weight, the treatment time is 20min, the treatment temperature is 20°C, and then washed in water at 30°C until the pH of the washing solution is 6.5, and then dry the graphite powder after washing in a drying oven at 150° C. for 5 hours.

[0032] Step 2, mechanically disperse and mix the dried flake graphite powder in a high-mixing disperser according to the ratio of flake graphite powder: graphite fiber = 1000: 1 parts by mass, and the dispersion time is 60 minutes, and then put it into a graphite expansion furnace Perform high-temperature expansion at 1200°C, and the high-temperature expansion time is 1s, and then make a high-thermal-conduction graphite heat sink reinforced by thermal-conductive fibers through a grap...

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Abstract

The invention provides a heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and a manufacturing method. The graphite cooling fin is a sheet product formed in the mode that mixed raw materials are expanded by a graphite expansion furnace at a high temperature and pressed by a graphite coiled material double-roller device, wherein the mixed raw materials comprise graphite powder and graphite fibers, the proportion of the graphite powder to the graphite fibers is 2-1000:1. The manufacturing method of the heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin overcomes the defects that in a traditional manufacturing process, the mechanical property is low, the service life is short, and dropping is easily caused, the mechanical strength and the purity are greatly improved, convenience is brought to follow-up machining and use, the heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin has the advantages of being light in weight, high in strength, high in heat-conduction performance and the like, and the using scope of graphite sheets is expanded.

Description

technical field [0001] The invention relates to a preparation method of a graphite heat sink, in particular to a preparation method of a high heat conduction graphite heat sink reinforced by a heat conduction fiber. Background technique [0002] With the rapid development of microelectronics integration technology and high-density printed board assembly technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by thousands of times, and electronic instruments and equipment are becoming lighter, thinner, shorter and smaller. direction development. Under high-frequency operating frequency, the working thermal environment of semiconductors moves rapidly towards high temperature. At this time, the heat generated by electronic components accumulates and increases rapidly. Under the ambient temperature of use, electronic components must still work normally with high reliability , and the ability to dissipate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 宫以娟朱焰焰
Owner TIANNUO PHOTOELECTRIC MATERIAL
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