Addition-type bi-component heat-conducting pouring sealant and preparation method thereof

A thermally conductive potting, two-component technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor substrate adhesion, no adhesion, and poor adhesion. , to achieve the effect of improving adhesive properties, excellent adhesive properties and low viscosity
CN104152103AActive Publication Date: 2014-11-19ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
2 Cites 43 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
Publication Date
2014-11-19

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses an addition-type bi-component heat-conducting pouring sealant and a preparation method thereof and belongs to the technical field of polymer materials. The pouring sealant is composed of a component A and a component B, wherein the component A contains 100 parts by weight of vinyl silicone oil, 0-2 parts by weight of hydrogen-contained silicon oil, 200-400 parts by weight of filler, 0.1-0.5 part by weight of inhibitor and 4-6 parts by weight of thickening agent; the component B contains 10-40 parts by weight of plasticizer and 0.3-0.8 part by weight of platinum catalyst; and the mass ratio of the component A to the component B is (8-12):(0.8-1.2). The pouring sealant disclosed by the invention has excellent heat conductivity, flowability and adhesive property. The thickening agent can be used as a main crosslinking agent for addition reaction and can be compounded with the hydrogen-contained silicon oil to realize curing reaction, so that the adhesive property of the pouring sealant to a base material can be improved, the steam is effectively prevented from permeating into electronic devices, a power source of a street lamp, a transformer and the like cannot be influenced by snowy and rainy weathers when working outdoors, and the reliability of equipment is improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention specifically relates to an addition-type two-component heat-conducting potting glue and a preparation method of the potting glue, belonging to the technical field of polymer materials. Background technique

[0002] In today's world, science and technology are changing with each passing day, and human society has entered the era of electronic information. With the improvement of market requirements for electronic technology and people's in-depth research, electronic components and logic circuits tend to be denser and miniaturized, thus putting forward higher requirements for the stability of electrical appliances. In the electronics industry, packaging is one of the necessary processes for electronic components. Packaging is the operation process of rationally arranging, assembling, bonding, connecting, isolating and protecting the various components that constitute electronic devices or integrated circuits according to the specified requi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More