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Laminate body, conductive pattern, electrical circuit, and method for producing laminate body

A manufacturing method and a technology of a laminate, which are applied in the directions of printed circuit manufacturing, conductive pattern layout details, and manufacturing of printed circuit precursors, etc., can solve the problems of reduced adhesion, increased resistance value, and undiscovered laminates, and achieves close adhesion. Excellent properties and excellent electrical conductivity

Active Publication Date: 2014-12-10
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the conductive pattern obtained through the above-mentioned step of irradiating ultraviolet rays causes a decrease in the adhesion of the interface between the above-mentioned support and the above-mentioned conductive material layer, resulting in a decrease in conductivity (increase in resistance value) and disconnection.
[0007] In this way, as a laminate represented by a conductive pattern, a laminate that has excellent adhesion between the support, the conductive layer, and the plating layer is required, but a laminate that can satisfy all these requirements has not yet been found. body

Method used

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  • Laminate body, conductive pattern, electrical circuit, and method for producing laminate body
  • Laminate body, conductive pattern, electrical circuit, and method for producing laminate body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0175]Using a spin coater, apply the above-mentioned primer (X-1) to the surface of a support comprising a polyimide film (Kapton 200H manufactured by Toray-DuPont Co., Ltd., thickness 50 μm) so that the thickness after drying reaches 0.1 μm, and then, using a hot air drier, it was dried at 80° C. for 5 minutes to form an undercoat layer on the surface of the above-mentioned support.

[0176] Next, the above-mentioned conductive ink 1 was coated on the surface of the above-mentioned undercoat layer by the spin coating method, and then fired at 250° C. for 3 minutes to prepare a layer containing silver corresponding to the above-mentioned layer (II′). (thickness 0.1 μm) substrate. The surface resistance of the layer corresponding to the above-mentioned layer (II') was measured by the method described later, and the result was 2Ω / □.

[0177] Next, use AP-T01 (manufactured by Sekisui Chemical Industry Co., Ltd., atmospheric pressure plasma processing apparatus, gas: air (oxygen ...

Embodiment 2

[0181] Instead of the corona discharge treatment using the above-mentioned AP-T01 (manufactured by Sekisui Chemical Industry Co., Ltd., atmospheric pressure plasma treatment device), TEC-4AX (manufactured by Kasuga Electric Co., Ltd., corona surface modification evaluation device, gas ; air (oxygen concentration is about 21% by mass), pitch: 1.5mm, output power: 100W, treatment time; 2 seconds) to implement corona discharge treatment, except that, utilize the same method as in Example 1 to obtain laminated A laminate (L-2) comprising the support layer (I), the primer layer (X), the conductive layer (II) and a layer corresponding to the plating layer (III). In addition, the surface resistance of the layer corresponding to the above-mentioned layer (II') before the corona discharge treatment was 3 Ω / □, and the surface resistance of the conductive layer after the corona discharge treatment increased to 5 Ω / □. In addition, the surface was analyzed using the same X-ray photoelectro...

Embodiment 3

[0183] The above-mentioned primer (X-1) is coated on the surface of a support body comprising a polyimide film (Kapton 200H manufactured by Toray-DuPont Co., Ltd.) using a spin coater so that the dry film thickness becomes 0.1 μm, and then, use The undercoat layer was formed on the surface of the above-mentioned support by drying with a hot air dryer at 80° C. for 5 minutes.

[0184] Next, using an inkjet printer (Konica Minolta IJ Co., Ltd. inkjet tester EB100, print head KM512L for evaluation, discharge volume 42pl), the above-mentioned conductive ink 2 was printed on the surface of the above-mentioned primer layer to a thickness of 0.5 pl. μm, a line width of 100 μm, and a length of 3 cm, and then dried at 150° C. for 1 hour to produce a silver-containing layer (thickness after drying: 0.1 μm, line A substrate with a width of 1mm and a length of 1cm). The surface resistance of the layer corresponding to the above-mentioned layer (II') was 2Ω / □.

[0185] Next, TEC-4AX (cor...

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Abstract

The problem addressed by the present invention is to provide a laminate body such as a conductive pattern having superior adhesion at the interfaces between a layer comprising a support body, a conductive layer containing a conductive substance, and a plating layer. The present invention pertains to: a laminate body having at least a support body layer (I), a conductive layer (II), and a plating layer (III), and characterized by the conductive layer (II) having an oxidized surface, and the plating layer (III) being laminated to the oxidized surface of the conductive layer (II); a conductive pattern; and an electrical circuit.

Description

technical field [0001] The present invention relates to a laminate such as a conductive pattern that can be used for manufacturing an electromagnetic wave shield, an integrated circuit, an organic transistor, and the like. Background technique [0002] In recent years, along with the high performance, miniaturization and thinning of electronic equipment, there are also strong demands for high density, miniaturization and thinning of electronic circuits and integrated circuits used therein. [0003] As a conductive pattern that can be used in the above-mentioned electronic circuit, etc., for example, a conductive pattern obtained by coating a conductive ink containing a conductive substance such as silver on the surface of a support, plating a nucleating agent, and firing is known. , thereby forming a conductive material layer, and then performing a plating treatment on the surface of the conductive material layer, thereby providing a plating layer on the surface of the condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/02C23C26/00H05K3/18
CPCH05K3/188H05K2203/0315H05K3/022C23C18/38C25D3/38C23C18/206H05K2203/0786H05K3/385C23C18/1879C23C18/2086C23C18/1893C23C18/30C09D11/322C23C18/1658C09D11/52B32B7/025B32B27/08C23C26/00H05K3/18B32B2307/202C25D3/02H05K1/0296H05K1/092
Inventor 富士川亘齐藤公惠村川昭白发润
Owner DIC CORP