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A production process of dust-proof and heat-conducting foam

A production process and foam technology, which is applied to the production process of dust-proof and thermally conductive foam, can solve problems such as inconvenience for enterprises, poor thermal conductivity and heat dissipation, and inability to fill the gaps of mechanical components, and achieve the effect of simple structure and stable and reliable work.

Inactive Publication Date: 2017-02-22
吴江市金顺工艺海绵制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology is to use graphite heat sink, but practice has proved that the more graphite layers, the thicker the graphite heat sink, the worse its thermal conductivity and heat dissipation performance; thus the thickness of the graphite heat sink is greatly limited, and it is impossible to fill the mechanism The gap between the parts brings great inconvenience to the enterprise

Method used

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  • A production process of dust-proof and heat-conducting foam

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The silicon dioxide with a particle diameter of 5nm accounts for 1% of the heat-dissipating coating; the titanium dioxide with a particle diameter of 10nm accounts for 1% of the heat-dissipating coating; the zirconium silicate with a particle diameter of 10nm accounts for 1% of the heat-dissipating coating. 1% of heat-dissipating coatings; high-molecular alkyl alcohol amide, its weight percentage accounts for 0.5% of heat-dissipating coatings; polymethylsiloxane, its weight percentage accounts for 0.5% of heat-dissipating coatings; polysiloxane, its weight percentage accounts for 0.5% of heat-dissipating coating; Epoxy resin, described synthetic resin coordinates the weight percent of above-mentioned composition to be mixed into 100% and is placed in the plastic container that capacity is 5L, with the stirring speed of 2500r / min by stirrer, the stirring time that maintains is 5min to make it fully mixed;

[0019] After the above mixture is fully stirred and mixed, then ...

Embodiment 2

[0022] Silicon dioxide with a particle size of 1 μm accounts for 15% by weight of the heat-dissipating coating; titanium dioxide with a particle size of 10 μm accounts for 5% of the heat-dissipating coating; zirconium silicate with a particle size of 2 μm accounts for 15% by weight of the heat-dissipating coating. 15% of heat-dissipating coatings; high-molecular alkanolamine amides, whose weight percentage accounts for 3% of heat-dissipating coatings; polymethylsiloxane, whose weight percentage accounts for 2% of heat-dissipating coatings; polysiloxane, whose weight percentage accounts for 2.5% of heat-dissipating paint; epoxy resin, the synthetic resin is mixed with the weight percentage of the above components to 100% and placed in a glass with a capacity of 5L, and the stirring time maintained by a stirrer at a stirring speed of 2550r / min is 6min , to make it fully mixed;

[0023] After the above mixture is fully stirred and mixed, add rose essence extracted from roses to i...

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Abstract

The invention provides a production process for dustproof heat-conducting foam. The production process includes stirring and fully mixing silicon dioxide, titanium dioxide, zirconium silicate, boron nitride, macromolecular alkyl alcohol amine amide, polymethylsiloxane, polysiloxane and epoxy resin, adding aromatic into the mixture, coating a PTE substrate film with the mixture after full mixing to form a heat-dissipation layer, and finally adhering a foam layer to the heat-dissipation layer by an adhesive sticker or a heat-conducting double-faced adhesive tape. Through high-efficiency heat dissipation of the heat-dissipation layer, heat energy can be quickly transmitted in three modes of conduction, convection and transmission of radiant heat; the heat-dissipation layer contains heat-conducting powder which is a nanometer material, the surface area of the heat-dissipation layer is doubled by the nanometer material, and the contact area between a composite material and the air or other liquid is also increased, so that convection of a heat-conducting coating is formed easily to help heat dissipation of products. The foam is simple in structure, stable and reliable in performance and easy to apply to industrial production.

Description

technical field [0001] The invention relates to a heat conduction device, in particular to a production process of dustproof heat conduction foam. Background technique [0002] In recent years, with the continuous development of electronic technology and the continuous updating of electronic products, the size of its working components has become smaller and smaller, especially for computers, which work at higher and higher speeds and with higher heat generation. Therefore, it is not only required to be equipped with a corresponding heat dissipation device, but also to ensure that the heat dissipation device has a stronger heat dissipation capacity to ensure the reliability and service life of the product performance. The existing technology is to use graphite heat sink, but practice has proved that the more graphite layers, the thicker the graphite heat sink, the worse its thermal conductivity and heat dissipation performance; thus the thickness of the graphite heat sink is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20B32B7/12B32B27/06B32B33/00C09D163/00C09D5/00C09D7/12
Inventor 徐静
Owner 吴江市金顺工艺海绵制品有限公司