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Method for recovering rare/inert metals from bottom electroplating copper/nickel material

A technology of inert metal and electroplating copper, which is applied in the field of industrial waste recycling, can solve problems such as unsuitability for industrial production, complex process flow, harsh reaction conditions, etc., and achieve the goal of being suitable for industrial production, simplifying process flow, and high gold recovery rate Effect

Inactive Publication Date: 2015-01-07
CHINA NAT ELECTRIC APP RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process is complex, and chlorides are introduced during the gold extraction process, and the waste liquid is not properly treated, which will cause serious environmental pollution
On December 26, 2007, Chen Liang, Wu Jun, Qiu Lijuan and others applied for a Chinese invention patent "a method for extracting gold from waste circuit boards" (application number 200710173128.8), in which the thiourea method was used to leach gold. Urea itself is unstable and the reaction conditions are difficult to control, so it is difficult to apply to industrial production
The overall technological process is relatively complicated, and the control of reaction conditions is relatively harsh, which is not suitable for industrial production, and a large number of ions that pollute the environment will be introduced during the reaction process, which increases the difficulty of subsequent waste liquid treatment.

Method used

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  • Method for recovering rare/inert metals from bottom electroplating copper/nickel material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Use a cleaning agent to remove the dust and oil on the surface of the waste circuit board, then rinse and dry it with clean water to obtain a clean waste circuit board; add complexing agent lactic acid and oxidant ferric chloride to the sulfuric acid aqueous solution to prepare a degold solution , wherein the mass concentration of sulfuric acid is 30%, the mass concentration of lactic acid is 1%, and the mass concentration of ferric chloride is 15%; the temperature is heated to 70°C, and the waste circuit board is left to soak in the degold solution for 4h, and then Stir for 30 minutes to complete the degolding; take out the circuit board, wash it, dry it, and collect it for refining other metals; filter the degolding solution to obtain the filter residue containing gold foil and copper-containing filtrate, wash the filter residue, dry it at high temperature and Smelting to obtain gold ingots, the recovery rate of gold reaches more than 98%; the copper-containing filtrat...

Embodiment 2

[0032] Use a cleaning agent to remove the dust and oil stains on the surface of the waste circuit board, then rinse and dry with clean water to obtain a clean waste circuit board; add complexing agent malic acid and oxidant potassium permanganate to sulfuric acid aqueous solution Gold solution, wherein the mass concentration of sulfuric acid is 20%, the mass concentration of malic acid is 3%, and the mass concentration of potassium permanganate is 13%; the temperature is heated to 50 ° C, and the waste circuit board is left standstill in the degold solution Soak for 2.5 hours, then stir for 20 minutes to complete the degolding; take out the circuit board, wash it, dry it, and collect it for refining other metals; filter the degolding solution to obtain the gold leaf-containing filter residue and copper-containing filtrate, and filter the filter residue Washing, high-temperature drying and smelting to obtain gold ingots, the recovery rate of gold is over 98%; the copper-containi...

Embodiment 3

[0034] Use a cleaning agent to remove the dust and oil stains on the surface of the waste circuit board, then rinse and dry it with clean water to obtain a clean waste circuit board; add complexing agent lactic acid and oxidant potassium permanganate to the sulfuric acid aqueous solution to configure solution, wherein the mass concentration of hydrochloric acid is 25%, the mass concentration of lactic acid is 4%, and the mass concentration of potassium permanganate is 17%; the temperature is heated to 50°C, and the waste circuit board is left to soak in the degold solution for 2h , and then stirred for 15 minutes to complete the degolding; the circuit board was taken out, washed, dried, and collected for refining other metals; the degolding solution was filtered to obtain the filter residue containing gold foil and the copper-containing filtrate, and the filter residue was washed and heated at high temperature Drying and smelting to obtain gold ingots, the recovery rate of gold...

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Abstract

The invention discloses a method for recovering rare / inert metals from a bottom electroplating copper / nickel material, which comprises the following steps: (1) pretreatment; (2) preparation of rare / inert metal removal liquid: adding a complexing agent and an oxidizer into an inorganic acid water solution to prepare the rare / inert metal removal solution, and heating the rare / inert metal removal solution to 50-70 DEG C; (3) oxidation and complexing of copper / nickel coating: immersing a dried electroplating material in the rare / inert metal removal solution, and standing until the rare / inert metal foil is thoroughly removed from the surface of the electroplating material base; (4) filtration and filter residue drying: taking out the electroplating material subjected to rare / inert metal removal, filtering the copper / nickel-containing solution with the rare / inert metal foil to obtain a filtration residue containing the rare / inert metal foil and / or a nickel ion filtrate, and washing and drying the filtration residue to obtain the rare / inert metal foil. The gold recovery rate of the method can reach 98% above.

Description

technical field [0001] The invention relates to a method for recovering rare and noble / inert metals, belonging to the field of industrial waste recycling, in particular to a method for recovering rare and noble / inert metals from bottom electroplating copper / nickel materials. Background technique [0002] At present, a large number of rare and precious metals in the industry exist in electroplating process parts, such as gold and silver jewelry, components, printed circuit boards, etc. Especially the printed circuit board, which is one of the important parts of the electronics industry, mainly provides support and connection for electronic components. From computers, televisions, mobile phones to electronic toys, etc., there are circuit boards in almost all electronic products. . According to statistics, if the service life of ordinary household appliances is calculated according to 10 to 15 years, 5 million TV sets, 4 million refrigerators and 6 million washing machines wil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B11/00
CPCY02P10/20
Inventor 王鹏程赵新符永高韩文生刘阳胡嘉琦顾宇昕
Owner CHINA NAT ELECTRIC APP RES INST
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