A kind of medium temperature solder containing copper and its alloy

Abstract

The invention discloses a medium-temperature solder containing copper and a copper alloy. The medium-temperature solder comprises the following components by weight percent: 1-5 percent of silver, 5-8 percent of phosphor, 1-6 percent of tin, 0.1-2.5 percent of silicon, 0.01-0.1 percent of cerium and the balance of copper. The medium-temperature solder disclosed by the invention has the advantages that the melting temperature of the solder is reduced, and the flowability is good; besides, the solder has good permeability and ductility and can infiltrate into a tiny clearance without generating a sand hole; meanwhile, the solder is used in an environment with greater temperature difference, and the damage to a weld seam is avoided. The medium-temperature solder disclosed by the invention is greatly used in the refrigeration industry.

Description

technical field [0001] The invention relates to the field of brazing materials, in particular to a medium-temperature brazing material containing copper and its alloys widely used in the refrigeration industry. Background technique [0002] With the development of electronic information industry, home appliances, automobiles and refrigeration industries, brazing technology is becoming more and more important in these industries, and the demand for brazing materials is increasing. According to the alloy system, brazing filler metals can be divided into more than ten categories such as silver-based, copper-based, aluminum-based, manganese-based, etc. Copper-based brazing filler metals occupy a large proportion in brazing filler metals, and are used in the brazing of some copper alloy parts with high requirements. In the process, copper-based materials with high silver content are required, but the price of silver as a precious metal has been rising, so companies need to reduce...

AI Technical Summary

Problems solved by technology

[0003] At present, there are also some copper-based solders with less silver content, such as BCu89PAg copper-based solder containing 5% silver, BCu91PAg copper-based solder containing 2% silver, etc. Although these copper-based solders are relatively cheap, their melting temperature Higher, the brazing process performance and the mechanical strength of the brazed joint are not up to the use requirements, and cannot meet the customer's requirements

[0004] Chinese Patent No. 201010588473.X discloses a patent titled "A Low-Silver Electric Vacuum Solder for Electronic Device Sealing and Soldering". It adds tin, indium and nickel to the conventional silver-copper solder to reduce the silver content. Content, and lower the melting point, can replace BAg72Cu solder, but the addition of tin, indium and nickel is relatively high

[0005] Chinese Patent No. 200610161439.8 discloses a patent titled "a copper-phosphorus-silver brazing filler metal containing doping, urination and decoration". And the melting point is lowered, but the amount of addition of marriage, indium and decoration is higher, and the proportion of phosphorus is also higher

If the liquidus of the solder is lower than 450°C, it is called solder, and if the liquidus is higher than 450°C, it is called hard solder. In some materials, solder is used in the connection process, but the strength of the joint is brazed with solder. And the use of working temperature can not meet the requirements; brazing with brazing material can achieve the required brazing strength, but because the physical structure and physical and chemical properties of the brazing material are quite sensitive to the influence of temperature, the tensile properties of the material, The shear resistance is weakened, causing weld cracks or pores during brazing, which reduces the sealing effect

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