Surfactant mixture for polysilicon suede making, suede making solution containing the same and suede making method
A surfactant and compound technology, which is applied in the field of surfactant compound to prepare polysilicon textured surface with low reflectivity, can solve the problem of affecting the photoelectric conversion efficiency of solar cells, unfavorable passivation film on the surface of polysilicon, and affecting the strength of silicon wafers and other problems, to achieve the effect of simple texture method, improved photoelectric conversion efficiency and low cost
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Embodiment 1
[0042] 1. The composition of surfactant compound is following three kinds of compounds and its ratio is:
[0043] C 14 h 29 CON(CH 2 CH 2 Oh) 2 :C 12 h 25 N(CH 2 CH 2 O) 15 H: C 14 h 29 O(CH 2 CH 2 O) 45 H=1:4:2.
[0044] 2. Composition of polysilicon texturing solution
[0045] The hydrofluoric acid with a concentration of 40%, the nitric acid with a concentration of 65%, and a surfactant compound were prepared in a polytetrafluoroethylene beaker according to a volume ratio of 30:70:1 to prepare a corrosion solution.
[0046] 3. Polysilicon Texturing
[0047] (1) Cleaning: After the polysilicon wafer was ultrasonically cleaned for 15 minutes, it was rinsed with deionized water for 60 seconds.
[0048] (2) Alkaline corrosion: immerse the polysilicon wafer cleaned in step (1) in 40°C, 5% NaOH solution and etch for 120s to remove the damaged layer on the surface of the silicon wafer, then rinse with deionized water for 60s to remove the surface of the polysilico...
Embodiment 2
[0053] 1. The composition of surfactant compound is the following three compounds and its ratio is: C 16 h 33 CON(CH 2 CH 2 Oh) 2 :C 8 f 17 O(CH 2 CH 2 O) 8 H: C 16 h 33 O(CH 2 CH 2 O) 30 H=1:2:6.
[0054] 2. Composition of polysilicon texturing solution
[0055] The hydrofluoric acid with a concentration of 40%, the nitric acid with a concentration of 65%, and a surfactant compound were prepared in a polytetrafluoroethylene beaker at a volume ratio of 20:80:0.5 to prepare an etching solution.
[0056] 3. Polysilicon Texturing
[0057] (1) Cleaning: After the polysilicon wafer was ultrasonically cleaned for 15 minutes, it was rinsed with deionized water for 60 seconds.
[0058] (2) Alkaline corrosion: immerse the polysilicon wafer cleaned in step (1) in 40°C, 5% NaOH solution and etch for 120s to remove the damaged layer on the surface of the silicon wafer, then rinse with deionized water for 60s to remove the surface of the polysilicon of lye.
[0059] (3) ...
Embodiment 3
[0063] 1. The composition of the surfactant compound is the following three compounds and the ratio is C 12 h 25 CON(CH 2 CH 2 Oh) 2 :C 16 h 33 N(CH 2 CH 2 O) 20 H: C 8 h 17 OC 6 h 4 (CH 2 CH 2 O) 30 H=1:4:5.
[0064] 2. Composition of polysilicon texturing solution
[0065] The hydrofluoric acid with a concentration of 40%, the nitric acid with a concentration of 65%, and a surfactant compound were prepared in a polytetrafluoroethylene beaker according to a volume ratio of 60:40:2 to prepare a corrosion solution.
[0066] 3. Polysilicon Texturing
[0067] (1) Cleaning: After the polysilicon wafer was ultrasonically cleaned for 15 minutes, it was rinsed with deionized water for 60 seconds.
[0068] (2) Alkaline corrosion: immerse the polysilicon wafer cleaned in step (1) in 40°C, 5% NaOH solution and etch for 120s to remove the damaged layer on the surface of the silicon wafer, then rinse with deionized water for 60s to remove the surface of the polysilicon ...
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