Vertical coupled feeding structure applied to millimeter-wave microstrip antenna

A microstrip antenna, vertical coupling technology, applied in the direction of the structure connection of the antenna grounding switch, the antenna grounding device, the structure of the radiating element, etc., can solve the problems of interfering with the antenna pattern and reducing the gain, reducing the plane cross-sectional area of ​​the system, avoiding the High inductance value, effect of reducing effective dielectric constant

Inactive Publication Date: 2015-04-29
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the traditional microstrip line feeds, the feeder and the microstrip antenna patch are coplanar, but at...

Method used

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  • Vertical coupled feeding structure applied to millimeter-wave microstrip antenna
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  • Vertical coupled feeding structure applied to millimeter-wave microstrip antenna

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Embodiment Construction

[0019] The substantive features and remarkable progress of the present invention will be further described below in conjunction with the accompanying drawings, but the present invention is by no means limited to the embodiments.

[0020] Embodiments of the present invention relate to a vertically coupled feeding structure applied to millimeter wave antennas, such as figure 1 As shown, the provided vertical feed structure includes a microstrip patch antenna 1, a bottom dielectric substrate substrate 2, a substrate cavity structure 3, a ground plane 4 with a gap, a top dielectric substrate substrate 5, a common Surface waveguide to microstrip feeder 6.

[0021] like figure 1 As shown, the microstrip patch antenna 1 is manufactured on the lower surface of the underlying dielectric substrate by using the semiconductor process through the process steps of sputtering-photolithography-electroplating-corrosion. The coplanar waveguide-to-microstrip feeder 6 and the ground plate 4 wit...

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Abstract

The invention relates to a vertical coupled structure applied to a millimeter-wave microstrip antenna. The vertical coupled structure comprises microstrip patch antennae, a bottom-layer medium chip substrate, a substrate cavity forming structure, a grounding plate with a gap, a top-layer chip substrate and a coplanar waveguide adapter microstrip feeder line. The microstrip patch antennae are arranged on the bottom sides of the bottom-layer medium chip substrate and the top-layer chip substrate. The substrate cavity forming structure is formed by forming a cavity in the bottom-layer medium chip substrate. The coupling caliber of the gap is located between a bottom-layer medium chip and a top-layer chip. The coplanar waveguide adapter microstrip feeder line is arranged on the upper surface of the top-layer chip substrate. The interlayer vertical interconnection problem of the antenna and a radio-frequency circuit when working frequency is within a millimeter-wave frequency range can be solved by means of the vertical coupled structure. The vertical coupled structure has the advantages of being free of weld points and parasitic radiation and capable of obtaining an even radiation pattern, overcoming the adverse influence brought by a traditional single feed mode and design limitations and the like.

Description

technical field [0001] The invention relates to a vertical coupling feeding structure applied to millimeter wave microstrip antennas, belonging to the field of millimeter wave microstrip antennas. Background technique [0002] Antenna is an important device necessary for radar, communication and other systems. Microstrip antenna has been widely used in the fields of imaging system antenna array and anti-collision radar because of its diverse design, low profile and easy conformality, multiple feeding methods, high performance and low cost. widely used. The basic ways to feed the microstrip antenna are: (1) feeding with the microstrip line; (2) feeding with the coaxial line. When applied to the interlayer signal interconnection of multilayer boards, the connection between the circuit and the antenna feed can generally be realized through cables and connectors in the microwave frequency band. When the operating frequency of the system continues to increase and reaches the Ka...

Claims

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Application Information

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IPC IPC(8): H01Q1/38H01Q1/48H01Q1/50
Inventor 孙芸孙晓玮崔恒荣
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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