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Radiation shielding electronic packaging material and preparation method for same

An electronic packaging material and radiation shielding technology, applied in shielding, circuits, electrical components, etc., can solve problems such as low yield, complicated molding process, and high cost

Active Publication Date: 2015-05-27
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the molding process of this method is complicated, the cost is high, and the yield is low, so it is difficult to popularize and use it on a large scale.

Method used

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  • Radiation shielding electronic packaging material and preparation method for same
  • Radiation shielding electronic packaging material and preparation method for same
  • Radiation shielding electronic packaging material and preparation method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The composition of the composite powder is: 14g of tungsten powder, 25g of 95 alumina porcelain powder, and 2.0g of silicon dioxide; ethanol is used as a dispersion medium and mixed evenly. After drying, 1.1 g of 7.0 wt % phenolic resin solution was added as a binder, mixed and granulated to obtain tungsten / alumina composite particles. The tungsten / alumina composite particles were dry-pressed and then sintered in a high-temperature tube furnace at a high temperature of 1400°C for 200 minutes to obtain a tungsten / alumina composite packaging material.

[0027] figure 2 , image 3 and Figure 4 The metallographic microscope image of the obtained composite packaging material, the scanning electron microscope image of the material section, and the X-ray diffraction image of the material are respectively shown.

Embodiment 2

[0029] The composition of the composite powder is: 63g of tantalum powder, 30g of 95 alumina ceramic powder, 0.5g of silicon dioxide, and 1.1g of yttrium oxide; methanol is used as a dispersion medium and mixed evenly. After drying, 1.2 g of 9.0 wt % polyvinyl alcohol solution was added as a binder, mixed and granulated to obtain tantalum / alumina composite particles. The tantalum / alumina composite particles were dry-pressed and then sintered in a high-temperature tube furnace at a temperature of 1400°C for 100 minutes to obtain a tantalum / alumina composite packaging material.

Embodiment 3

[0031] The composition of the composite powder is: 30g of bismuth oxide powder, 15g of 95 alumina ceramic powder, 0.8g of calcium oxide, and 0.8g of silicon dioxide; acetone is used as a dispersion medium and mixed evenly. After drying, 2.8 g of 4.0 wt % polyvinyl alcohol solution was added as a binder, mixed and granulated to obtain bismuth oxide / alumina composite particles. Bismuth oxide / alumina composite particles were dry-pressed and then sintered in a high-temperature tube furnace at a temperature of 1500°C for 200 minutes to obtain a bismuth oxide / alumina composite packaging material.

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Abstract

The invention discloses a radiation shielding electronic packaging material, which comprises a sintered body of a composition, wherein the composition comprises heavy metal or heavy metal compound powder serving as a radiation shielding functional component, alumina ceramic powder serving as a substrate component, a sintering aid and an adhesive. The radiation shielding electronic packaging material is prepared by the following steps: uniformly mixing the heavy metal or heavy metal compound powder, the alumina ceramic powder and the sintering aid by taking an organic solvent as a dispersion medium; mixing the adhesive into the mixture after the mixture is dried, and performing granulation to obtain composite granules; performing dry-pressing molding and high-temperature sintering. The obtained material has high ray shielding performance, particularly high X and gamma ray radiation shielding performance.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and in particular relates to an electronic packaging material with high-energy X and gamma ray radiation protection performance and a preparation method thereof. Background technique [0002] Electronic components working in a high-energy radiation environment, because the radiation resistance level of electronic devices and chips is very low, especially after the chips are irradiated by X and gamma rays, the radiation particles interact with the electrons in the material to produce ionization effects and damage the chips , causing the performance degradation of the integrated circuit, leading to logic function errors or even complete permanent damage, thereby causing the overall failure of electronic components. Radiation shielding can effectively improve the radiation resistance level of electronic devices and chips. However, the existing shielding methods have the disadvantages o...

Claims

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Application Information

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IPC IPC(8): G21F1/08C04B35/10C04B35/622H01L23/552
CPCG21F1/085G21F1/02H01L23/291H01L23/552
Inventor 张衍李作胜方俊刘育建
Owner EAST CHINA UNIV OF SCI & TECH
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