Degradable substrate for flexible photoelectric device and production method of substrate
A technology for optoelectronic devices and substrates, applied in the fields of electro-solid devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve the problems of electronic waste pollution, reduce water and oxygen penetration, etc., to improve performance, increase binding force, and reduce crystallinity. Effect
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[0094] The preparation method of the degradable flexible optoelectronic device substrate is characterized in that it comprises the following steps:
[0095] ① Clean the rigid substrate with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;
[0096] ② Prepare flexible substrates on rigid substrates by roller coating, LB film method, scraping coating, spin coating, drop coating, spray coating, pulling method, casting method, dip coating, inkjet printing, self-assembly or screen printing, The flexible substrate is shellac, and the shellac is mixed with ultraviolet sensitive glue, and the composition and mass ratio of the ultraviolet sensitive glue are:
[0097] Photosensitive polysiloxane 90-98%
[0098] Photoinitiator 1-6.5%
[0099] Diluents and additives 1-4.5%;
[0100] The diluent includes toluene, xylene, active epoxy resin diluent, cyclic ether and vinyl ether monomer, and the auxiliary agent includes filler, stabilizer and crosslinking agent...
Embodiment 1
[0106] Such as figure 1 The substrate structure shown includes a flexible substrate 2 and a conductive layer 1, the flexible substrate 2 is shellac doped with UV-sensitive glue, and the conductive layer 1 is graphene.
[0107] The preparation method is as follows:
[0108] ① Clean the rigid substrate with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;
[0109] 2. on the rigid substrate, adopt spin coating to prepare shellac and UV-sensitive glue mixed film (the mass ratio of UV-sensitive glue is 0.5%), and film thickness is 50 μ m, and the raw material of described UV-sensitive glue comprises following composition:
[0110] Photosensitive polysiloxane 90%
[0111] Photoinitiator 6.5%
[0112] Diluents and additives 3.5%;
[0113] ③ Prepare a conductive layer from the graphene aqueous dispersion in ② surface spraying method, with a height of 20cm, a spraying pressure of 0.3MPa, a spraying rate of 0.3mL / min, and a thickness of the conductive la...
Embodiment 2
[0119] Such as figure 1 The substrate structure shown includes a flexible substrate 2 and a conductive layer 1, the flexible substrate 2 is shellac doped with ultraviolet sensitive glue, and the conductive layer 1 is carbon nanotubes.
[0120] The preparation method is as follows:
[0121] ① Clean the rigid substrate with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;
[0122] 2. on the rigid substrate, adopt spin coating to prepare shellac and UV-sensitive glue mixed film (the mass ratio of UV-sensitive glue is 1%), and film thickness is 100 μ m, and the raw material of described UV-sensitive glue comprises following composition:
[0123] Photosensitive polysiloxane 92%
[0124] Photoinitiator 3.5%
[0125] Diluents and auxiliaries 4.5%;
[0126] ③ Prepare a conductive layer with carbon nanotube aqueous dispersion in ② surface spraying method, with a height of 20cm, a spraying pressure of 0.3MPa, a spraying rate of 0.3mL / min, and a thickness...
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