Soldering flux for confluence strap of solar cell module and preparation method of soldering flux
A solar cell and solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems that affect the efficacy of components, and achieve the effects of improving solderability, increasing peel strength, and reducing the melting point of alloys
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Embodiment 1
[0031] The solder used on the busbar of the solar cell module in this embodiment is composed of the following components by weight: tin: 62wt%, bismuth: 1.0wt%, antimony: 2.0wt%, gallium: 0.03wt%, indium: 1.5 wt%, germanium: 1wt%, titanium: 0.1wt%, nickel: 0.5wt%, palladium: 0.005wt%, and the balance is lead.
[0032] The method for preparing the above-mentioned solder on the busbar of a solar cell module is as follows:
[0033] Pre-treatment: Remove oil stains and oxides on the surface of the substrate by alkali washing and acid washing;
[0034] Hot dip plating: the substrate is immersed in the molten metal solution configured by weight percentage, and the hot dip plating temperature is 240 degrees Celsius to form a coating;
[0035] Post-treatment: surface chemical treatment, tape-making, cutting and reeling.
Embodiment 2
[0037] The solder used on the busbar of the solar cell module in this embodiment is composed of the following components by weight: tin: 64wt%, bismuth: 0.01wt%, antimony: 0.01wt%, gallium: 0.015wt%, indium: 0.05 wt%, germanium: 0.005wt%, titanium: 0.005wt%, nickel: 0.05wt%, palladium: 0.1wt%, and the balance is lead.
[0038] The method for preparing the above-mentioned solder on the busbar of a solar cell module is as follows:
[0039] Pre-treatment: Remove oil stains and oxides on the surface of the substrate by alkali washing and acid washing;
[0040] Hot dip plating: the substrate is immersed in the molten metal solution configured by weight percentage, and the hot dip plating temperature is 300 degrees Celsius to form a coating;
[0041] Post-treatment: surface chemical treatment, tape-making, cutting and reeling.
Embodiment 3
[0043] The solder used on the busbar of the solar cell module in this embodiment is composed of the following components by weight: tin: 62.5wt%, bismuth: 0.5wt%, antimony: 1.0wt%, gallium: 0.025wt%, indium: 1.5wt%, germanium: 0.5wt%, titanium: 0.05wt%, nickel: 0.5wt%, palladium: 0.005wt%, and the balance is lead.
[0044] The method for preparing the above-mentioned solder on the busbar of a solar cell module is as follows:
[0045] Pre-treatment: Remove oil stains and oxides on the surface of the substrate by alkali washing and acid washing;
[0046] Hot dip plating: the substrate is immersed in the molten metal solution configured by weight percentage, and the hot dip plating temperature is 260 degrees Celsius to form a coating;
[0047] Post-treatment: surface chemical treatment, tape-making, cutting and reeling.
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