A kind of manufacturing method of high-frequency characteristic copper-clad laminate

A production method and high-frequency characteristic technology, which is applied in the field of high-frequency characteristic copper clad laminates, can solve the problems of poor PCB processing performance, low glass transition temperature, brittle polyphenylene ether material, etc., and achieve excellent flame retardancy and excellent mechanical properties Performance, Effect of High Glass Transition Temperature

Active Publication Date: 2017-04-12
PUTIAN HANJIANG YD PCB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in recent years, high-frequency copper-clad laminates developed at home and abroad, such as polyimide resin-based copper-clad laminates, polytetrafluoroethylene-based copper-clad laminates, and polyphenylene ether resin-based copper-clad laminates, have been applied to high-performance PCBs, but they have their own For example: high moisture absorption of polyimide material, low glass transition temperature of polytetrafluoroethylene material, poor processing performance, expensive price, brittle polyphenylene ether material, poor PCB processing performance, etc.

Method used

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  • A kind of manufacturing method of high-frequency characteristic copper-clad laminate
  • A kind of manufacturing method of high-frequency characteristic copper-clad laminate
  • A kind of manufacturing method of high-frequency characteristic copper-clad laminate

Examples

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Embodiment 1

[0030] A method for manufacturing a high-frequency characteristic copper clad laminate includes the following steps:

[0031] 1. First add 100 parts by weight of bisphenol A type bifunctional novolac epoxy resin and 22 parts by weight of bisphenol A type cyanate resin into the reactor, and then add 10 parts by weight of miscellaneous Biphenyl polyaryl ether, hetero narbiphenyl polyaryl ether is dissolved in dimethyl formamide before adding, and then the temperature of the reaction kettle is heated to about 100 ℃, and the mixture is uniformly stirred for 3 hours to prepare the poly nararyl biphenyl polyaryl ether. Ether / epoxy blend.

[0032] 2. Take 30 parts by weight of diaminodiphenyl sulfone (DDS) curing agent and 0.09 parts by weight of dimethylimidazole curing accelerator into the dissolving tank, then add 35 parts by weight of acetone as solvent, and stir to diaminodiphenyl After the sulfone and dimethylimidazole were completely dissolved, they were added to the reaction kett...

Embodiment 2

[0036] A method for manufacturing a high-frequency characteristic copper clad laminate includes the following steps:

[0037] 1. First add 105 parts by weight of bisphenol A type bifunctional novolac epoxy resin and 27 parts by weight of bisphenol A cyanate resin into the reactor, and then add 12 parts by weight of miscellaneous naphthalene Biphenyl polyaryl ether, hetero narbiphenyl polyaryl ether is dissolved in dimethyl formamide before adding, and then the temperature of the reactor is heated to about 100 ℃, and the mixture is uniformly stirred for 3 hours. Ether / epoxy blend.

[0038] 2. Take 33 parts by weight of diaminodiphenyl sulfone (DDS) curing agent and 0.06 parts by weight of 2-ethylimidazole curing accelerator into the dissolving tank, then add 40 parts by weight of methyl ethyl ketone as a solvent, and stir to diamino After the diphenyl sulfone and 2-ethylimidazole were completely dissolved, they were added to the reactor containing 135 parts by weight of the polyary...

Embodiment 3

[0042] A method for manufacturing a high-frequency characteristic copper clad laminate includes the following steps:

[0043] 1. First add 110 parts by weight of bisphenol A type bifunctional novolac epoxy resin and 20 parts by weight of bisphenol A cyanate resin into the reactor, and then add 15 parts by weight of miscellaneous Biphenyl polyaryl ether, hetero narbiphenyl polyaryl ether is dissolved in dimethyl formamide before adding, and then the temperature of the reaction kettle is heated to about 100 ℃, and the mixture is uniformly stirred for 3 hours to prepare the poly nararyl biphenyl polyaryl ether. Ether / epoxy blend.

[0044] 2. Take 27 parts by weight of diaminodiphenyl sulfone (DDS) curing agent and 0.075 parts by weight of dimethylimidazole curing accelerator into the dissolving tank, then add 45 parts by weight of acetone as a solvent, and stir to diaminodiphenyl After the sulfone and dimethylimidazole were completely dissolved, they were added to the reactor contain...

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Abstract

The invention relates to a high frequency-characteristic copper-clad plate manufacturing method. The method comprises the following steps: 1)a poly phthalazinone ether / epoxy resin blend is prepared; 2)a sol is prepared; 3)a prepreg is manufactured; and 4)the copper-clad plate is manufactured. As the epoxy resin is modified by poly phthalazinone ether, the manufactured poly phthalazinone ether resin-based high-frequency copper-clad plate overcomes defects such as high moisture absorption, poor processing property, poor impact-resisting property and high price of the existing high-frequency plate. In addition, the manufactured high-frequency copper-clad plate has the following advantages of excellent dielectric property and high glass transition temperature, excellent mechanical property and dimensional stability, excellent heat-resisting property, good processing property, and excellent flame-retardant property. The high-frequency copper-clad plate of the invention can meet requirements of manufacturing a high-frequency, high-speed and high-property circuit board.

Description

Technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a method for manufacturing high-frequency characteristic copper clad laminates. Background technique [0002] With the continuous development of the electronic information industry, nowadays, the penetration of computers, mobile communications and networks into every corner of life has made human society steadily moving towards a highly informatized direction. Information processing and information communication constitute highly informatized science and technology. Two technical pillars in the development of the field. Information processing technology based on high-level electronic computers pursues high-speed information processing, increased memory capacity, and miniaturization; on the other hand, in terms of information and communication technology, to ensure that it continues to increase In order to increase the number of channels, achieve high performance and mul...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06B32B38/16C08L63/04C08L79/04C08L71/10
Inventor 刘胜贤蹇锡高王锦艳
Owner PUTIAN HANJIANG YD PCB CO LTD
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