Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method

A chemical plating solution and diamond technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as scratches on the workpiece surface, diamond abrasive grain falling off, affecting workpiece quality, etc., and achieve grinding efficiency And the effect of life-enhancement, increased holding power, and fast response speed

Active Publication Date: 2015-09-30
北京国瑞升精机科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, there are the following problems in common nickel-plated diamond abrasive grains: in diamond abrasive tools, the bonding strength of resin bond to diamond is much lower than that of metal bond, although the surface of common nickel-plated diamond abrasive grain has a certain roughness, However, ordinary nickel-plated diamond abrasive grains sometimes still fall off from the resin bond, which causes scratches on the surface of the workpiece when the abrasive tool is in use, affecting the quality of the workpiece
[0011] Other adopt the method for electroless plating to prepare nickel-plated thorn diamond abrasive grain, the chemical plating solution formula and the process method of nickel-plated thorn on the surface of diamond abrasive grain have not been reported

Method used

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  • Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method
  • Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method
  • Chemical plating solution for preparing nickel splinter plated diamond abrasive particle, and chemical plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Example 1: 95 μm nickel-plated thorny diamond abrasive grains

[0066] 1. Take 95μm 1000ct diamond abrasive raw material, pre-sensitization treatment, activation treatment and reduction treatment to obtain reduced diamond, specifically:

[0067] Take 1000ct of 95μm diamond abrasive grains, add 2L of 0.5g / L stannous chloride solution, sensitize for 30min, and wash to obtain sensitized diamond;

[0068] Add 2L of 0.5g / L palladium chloride solution to the sensitized diamond, activate it for 30 minutes, and wash to obtain activated diamond;

[0069] Add 1L of 30g / L sodium hypophosphite solution to the activated diamond, perform reduction treatment for 30min, and wash to obtain reduced diamond;

[0070] 2. Electroless nickel plating stage:

[0071] Prepare the electroless plating solution according to the ratio of Example 1 in Table 1, mix the reduced diamond obtained in step 1 with the 4L configured electroless plating solution to carry out the electroless nickel plating ...

Embodiment 2

[0085] Example 2: 45 μm nickel-plated thorny diamond abrasive grains

[0086] 1. Pre-sensitization treatment, activation treatment and reduction treatment of 1000ct diamond abrasive raw materials of 45 μm are taken to obtain reduced diamond, which specifically includes the following steps:

[0087] Sensitization treatment: Take 1000ct of diamond abrasive grains with a particle size of 45μm, add 2L of 0.5g / L stannous chloride solution, perform sensitization treatment for 30min, and wash to obtain sensitized diamond;

[0088] Activation treatment: Add 2L of 0.5g / L palladium chloride solution to the sensitized diamond obtained in step 1, activate it for 30 minutes, and wash to obtain activated diamond;

[0089] Reduction treatment: Add 2 L of 30 g / L sodium hypophosphite solution to the activated diamond obtained in step 2, perform reduction treatment for 30 minutes, and wash to obtain reduced diamond;

[0090] 2. Prepare the electroless plating solution according to the ratio of...

Embodiment 3

[0095] Example 3: 60 μm nickel-plated thorny diamond abrasive grains

[0096] 1. Pre-sensitization treatment, activation treatment and reduction treatment of 1000ct diamond abrasive raw materials are taken to obtain reduced diamonds, including the following steps:

[0097] Take 1000ct of diamond abrasive raw material with a particle size of 60 μm, add 1L of 1.5g / L stannous chloride solution, perform sensitization treatment for 40min, and wash to obtain sensitized diamond;

[0098] Add 1L of 1.5g / L palladium chloride solution to the sensitized diamond, activate it for 40 minutes, and wash to obtain activated diamond;

[0099] Add 1L of 30g / L sodium hypophosphite solution to the activated diamond, perform reduction treatment for 40min, and wash to obtain reduced diamond;

[0100] 2. Prepare the electroless plating solution according to the ratio of Example 3 in Table 1, mix the reduced diamond obtained in step 1 with 4L of the prepared electroless plating solution to carry out ...

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PUM

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Abstract

The invention relates to a chemical plating solution for preparing a nickel splinter plated diamond abrasive particle, and a chemical plating method. The chemical plating solution is an aqueous solution containing nickel sulfate, sodium hypophosphate, sodium citrate, sodium acetate, a stabilizing agent, aminobenzenesulfonic acid and sodium benzenesulfinate. A layer of metallic nickel is deposited on the surface of a diamond particle by using an oxidation reduction reaction through adopting the chemical plating method to form splinter-shaped protrusions in order to prepare diamond abrasive particle with a nickel splinter layer. The abrasive particle has high specific surface area, and can be widely used in diamond tools made of a resin binder to increase the holding force between diamond and the resin and increase the heat conductivity of products of the tools in order to enhance the grinding efficiency of produced tools and prolong the life of the tools.

Description

technical field [0001] The invention relates to a diamond abrasive grain and a preparation method thereof, in particular to an electroless plating solution and an electroless plating method for producing nickel-plated thorny diamond abrasive grains. Background technique [0002] Diamond has a series of excellent physical and chemical properties such as high hardness, high strength, high wear resistance and small linear expansion coefficient, and has been increasingly widely used in the field of grinding. However, under normal temperature and pressure, diamond is in a metastable state, its heat resistance is not high, and there are some surface defects. During the processing, reactions such as oxidation weight loss or graphitization often occur, thereby reducing processing efficiency. In addition, because the diamond abrasive grains and the bonding agent in the abrasive tool are generally inlaid mechanically, the diamond abrasive grains are easy to fall off under the action o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36C23C18/18
Inventor 张恒
Owner 北京国瑞升精机科技有限公司
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