Ultra-thin single crystal copper flat silk ribbon and preparation method thereof

Abstract

The invention provides an ultra-thin single crystal copper flat silk ribbon and relates to the field of bonding lead production technology. The silk ribbon is made of single crystal copper and auxiliary materials, wherein the ratio of platinum-rhodium to the auxiliary materials is 99.99:0.01. The auxiliary materials comprise, by weight, 0.5-1.5 parts of iron, 1.5-2.5 parts of copper, 1-3 parts of manganese, 2-4 parts of magnesium, 1-4 parts of chrome, 3-4 parts of titanium, 2-4 parts of beryllium, 3-5 parts of aluminum and 2-5 parts of zinc. The beneficial effects are that technical processes are simple and raw material ratio is proper; the bonding silk is made with the proper ratio of single crystal copper and auxiliary materials in orderly steps, so product quality is high, fineness is high, requirements in current electronic industry are met, and the silk ribbon is especially suitable for semiconductor high-power integrated circuit elements, has remarkable effects in use and is easy to promote and use.

Description

technical field [0001] The invention relates to the technical field of bonding wire production, in particular to an ultra-fine single crystal copper flat ribbon and a preparation method thereof. Background technique [0002] Bonding wires are widely used in LEDs and semiconductor integrated circuits, such as consumer ICs: computers, mobile phones, televisions and other chips. Industrial IC: large-scale servers, motors, smart instruments, storage, medical equipment and other chips, and electronic packaging such as solar photovoltaics and diode transistors. [0003] With the development of the market and technology, the function of the chip is continuously enhanced, the number of leads is increasing, and the volume is getting smaller and smaller, which leads to the continuous increase of the area ratio of the pad in the entire chip. Therefore, research on ultra-fine pitch bonding Technology is a key technology that must be solved to solve the miniaturization of chips, but the...

AI Technical Summary

Problems solved by technology

[0003] With the development of the market and technology, the function of the chip is continuously enhanced, the number of leads is increasing, and the volume is getting smaller and smaller, which leads to the continuous increase of the area ratio of the pad in the entire chip. Therefore, research on ultra-fine pitch bonding Technology is a key technology that must be solved to solve the miniaturization of chips, but the performance of the bonding wire produced on the market is still relatively poor, and when it is prepared, the ingredients selected are unreasonable, and the processing method is lacking. It is easy to cause the leads to be uneven enough, the effect of use is not obvious, and it cannot meet people's needs