Silver alloy wire

Abstract

The invention provides a silver alloy wire comprising a core wire, wherein the core wire contains silver, palladium, a first adding component and a second adding component; the first adding component can be platinum, nickel, copper or a combination thereof; the second adding component can be germanium, cerium, gold, iridium and a combination thereof; and based on the total weight of the core wire, the content of the palladium is larger than or equal to 1.1wt% and smaller than or equal to 2.8wt%, the content of the first adding component is larger than 0.1wt% and smaller than 1wt%, and the content of the second adding component is larger than 0.02wt% and smaller than 0.2wt%. Therefore, the silver alloy wire is favorable in conductivity, oxidation resistance, wire stretching operating performance, heading stability and reliability.

Description

technical field [0001] The invention relates to the related fields of semiconductor and LED packaging, in particular to a silver alloy wire with silver as the main component. Background technique [0002] In view of the good ductility, electrical conductivity, and resistance to oxidation of gold wires, most of the wire bonding manufacturing methods in the early semiconductor field used gold wires with a wire diameter of 15 to 50 microns (μm) to connect the chip to the wire. The substrates are interconnected for signal transfer purposes. [0003] However, as the price of gold soars year by year and the brittle intermetallic compound formed at the interface between the gold wire and the aluminum pad is easy to deteriorate the reliability of the contact, the industry turns to the cheap copper wire instead of gold wire to reduce the reliability of electronic products Production costs, and the copper wire has the advantages of high strength and is not easy to form intermetallic ...

AI Technical Summary

Problems solved by technology

[0005] However, the interface between the pure silver wire and the aluminum pad is still easy to form such as Ag 2 Al or Ag 4 Al and other brittle intermetallic compounds, which will deteriorate the interface bonding strength of pure silver wire; The palladium concentration layer formed in the pure silver wire improves the interface bonding strength and wire strength

[0006] However, a sufficient amount of palladium must be added to the silver alloy wire to ensure that the interface bonding strength is improved, and the composition must be adjusted according to the required resistivity value. If palladium is included in the composition to obtain a lower resistivity, Then the composition of palladium must be controlled at a lower range value, but in this way, not only the interface bonding strength of the silver alloy wire cannot be improved, but also the oxygen content of the silver alloy wire will be increased, and the oxidation resistance of the silver alloy wire will be deteriorated. As a result, it is difficult for the silver alloy wire rods of the prior art to obtain the required wire drawing workability, ball stability and reliability, which affects the utilization rate of the silver alloy wire rods

[0007] If you want to try to improve the problem that the silver alloy wire is easy to oxidize, the existing technology needs to use expensive and dangerous hydrogen and nitrogen manufacturing methods in the wire bonding manufacturing method to reduce the degree of oxidation of the silver alloy wire. The wire bonding manufacturing method not only increases the risk of the manufacturing method, but also increases the operating cost of the wire bonding manufacturing method.

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