Nano-zirconia mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging and preparation method thereof

Abstract

The invention discloses a nano-zirconia mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging. The composite is a high-performance material formed by polymerizing and curing vinyl phenyl silicone oil, hydrogen containing silicon resin, vinyl silicon resin and methyl methacrylate and has the mixed advantages of organic silicon resin and poly methyl methacrylate. Good mechanical performance and optical performance are achieved. Nano-zirconia and graphene composite powder which is subjected to surface treatment of the silane coupling agent and coated with silica sol is mixed in the organic silicon resin-polymethyl methacrylate composite and is good in compatibility with resin, dispersity in resin is good, the optical performance and mechanical performance of the material can be further improved, and the performance of heat conduction, cooling, high temperature ageing resistance and the like is improved. The prepared material is stable in performance, durable, high in transparency, and especially suitable for being used as a packaging material for high-power LEDs.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a high-performance silicone resin-polymethyl methacrylate composite material mixed with nano-zirconia for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips, which plays a key role in the LED industry chain. The packaging materials used are used to fix and protect the chip from environmental temperature, humidity, external mechanical vibration, impact and other factors. To change the component parameters, on the other hand, it is to reduce the gap between the chip and the refractive index of the air to increase the light efficiency and dissipate the generated heat in time. Commonly used packaging materials mainly include epoxy resin, modified epoxy resin and silicone resin. Epoxy resins are mainly used for low-power LED packaging materials, which are limited in high-power LED ...

AI Technical Summary

Problems solved by technology

[0003] At present, the performance requirements of high-power LEDs on the market for packaging materials mainly include: high refractive index, high light transmittance, high thermal conductivity, UV resistance, heat aging resistance, and low thermal expansion coefficient. China's silicone packaging materials mainly rely on imported products, and these products still have many defects, such as low mechanical strength, poor resistance to ultraviolet radiation, refractive index, light transmittance, thermal conductivity, and the concentration of modified fillers in silicone resins. Dispersion, compatibility, stability after encapsulation, etc. need to be further improved